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Pressure sensor module

A pressure sensor, pressure technology, applied in the measurement of fluid pressure, instruments, fluid pressure measurement using piezoelectric devices, etc., can solve the problems of high range, low piezoelectric performance, etc., to simplify the structure, improve sealing performance, and improve stability. The effect of sex and precision

Inactive Publication Date: 2020-08-28
岳保丽
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to make up for the deficiencies of the existing technology and solve the problem of how to use a pressure chip with low piezoelectric performance to achieve higher sensitivity and a larger range, a pressure sensor module proposed by the present invention

Method used

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Embodiment approach

[0032] As an embodiment of the present invention, the cross-sectional area of ​​the second cavity 11 is larger than the cross-sectional area of ​​the third cavity 15, and the middle part of the upper end of the sealing cover 10 is fixedly provided with a sealing column 13, and the sealing column 13 The upper end extends into the third cavity 15 and is slidably sealed with the third cavity 15; the sealing column 13 and the third cavity 15 are set, mainly through the structure to change K 0 constant, to adjust the deformation speed of the pressure chip 9 in the first stage, that is, to adjust the corresponding sensitivity; at the same time, the sealing column 13 and the third cavity 15 can also play a guiding role, so that the sealing cover 10 is better vertically Move down to avoid tilting stuck.

[0033] As an embodiment of the present invention, the sealing column 13 is connected to the top end of the third cavity 15 by a spring 19; and the self-weight of the sealing cover 1...

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Abstract

The invention relates to the technical field of pressure sensor modules, and in particular, relates to a pressure sensor module which comprises a shell; an air inlet pipe is arranged on the right sideof the lower end of the shell, and a wire outlet pipe is arranged on the right side of the upper end of the shell; a first cavity, an installation cavity and a third cavity are sequentially formed inthe shell from bottom to top, the first cavity is communicated with the air inlet pipe through an airflow channel, the installation cavity is communicated with the wire outlet pipe through a wiring hole, and a sealing plug is arranged in the wire outlet pipe. Under the condition that the maximum deformation of a pressure chip is not changed, through the arrangement of a second cavity and the first cavity, the pressure chip deforms downwards in the reverse direction under the small pressure and deforms upwards in the forward direction under the large pressure, and the sensitivity and the measuring range of the pressure sensor module are improved in proportion under the condition of low cost.

Description

technical field [0001] The invention relates to the technical field of pressure sensor modules, in particular to a pressure sensor module. Background technique [0002] The gas pressure pressure sensor module is an integrated pressure sensor module, which is widely used in pneumatic control, pressure switch and controller, portable pressure gauge and pressure gauge, MAP (manifold absolute pressure sensor) and other fields. In addition to high requirements on sensitivity, stability, and durability of the sensor module, the packaging process is also required to be simple, low in cost, and economical and applicable. [0003] The existing Chinese patent (application number CN2017204888694) discloses a small silicon piezoresistive gas pressure pressure sensor module structure, including a housing, a ceramic base, a pressure chip, and a circuit board; a cavity is formed in the housing, and the ceramic base is mounted on In the cavity of the shell, the pressure chip is installed o...

Claims

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Application Information

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IPC IPC(8): G01L9/08G01L19/00G01L19/06
CPCG01L9/08G01L19/00G01L19/0618
Inventor 岳保丽陈海涛
Owner 岳保丽
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