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Alignment device and method, film forming device and method, method for manufacturing electronic device, recording medium, and program

A technology of an alignment device and a film-forming device, which is applied in the manufacture of semiconductor/solid-state devices, electrical solid-state devices, electrical components, etc., can solve the problems of reduced precision, individual differences in masks, and offset of positional relationships, and achieves the goal of suppressing alignment The effect of reduced precision

Pending Publication Date: 2020-09-04
CANON TOKKI CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, the masks used in the film formation process usually have individual differences for each mask
As a result of intensive studies by the inventors of the present invention, it has been found that such individual differences for each mask, especially when the thickness of the mask differs for each mask, is one of the factors that reduce the accuracy of alignment. reason
That is, as described above, the substrate whose positional displacement has been adjusted by the alignment process is preferably moved to a position as close as possible to the mask relative to the mask before being placed on the mask. If the difference (difference in thickness) between the substrate and the mask after alignment is set to a fixed value, the distance between the substrate and the mask can be seen in the process of placing the substrate on the mask after the alignment is completed. The adjusted positional relationship between may be shifted again by the mask

Method used

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  • Alignment device and method, film forming device and method, method for manufacturing electronic device, recording medium, and program
  • Alignment device and method, film forming device and method, method for manufacturing electronic device, recording medium, and program
  • Alignment device and method, film forming device and method, method for manufacturing electronic device, recording medium, and program

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Embodiment Construction

[0038] Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred structures of the present invention, and the scope of the present invention is not limited to these structures. In addition, in the following description, the hardware configuration and software configuration, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the device are not intended to limit the scope of the present invention unless otherwise specified.

[0039] The present invention relates to a technique for high-precision position adjustment of a substrate. The present invention can be preferably applied to an apparatus for forming a thin film (material layer) of a desired pattern on the surface of a substrate by vacuum evaporation or sputtering. Any material such as glass, resin, or metal can be selected as the material of th...

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PUM

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Abstract

The invention relates to an alignment device, a film forming device, an alignment method, a film forming method, a method for manufacturing an electronic device, a recording medium, and a program. Thepresent invention suppresses a decrease in alignment accuracy due to individual differences in masks. The alignment device is provided with a control unit for controlling a movement mechanism and a position adjustment mechanism, and a thickness information acquisition means for acquiring thickness information of a mask (220). The movement mechanism moves at least one of a substrate (10) and the mask (220) in a first direction so as to bring the substrate (10) and the mask (220) closer to each other or separate from each other; the position adjustment mechanism adjusts a relative position between the substrate (10) and the mask (220); the control unit controls the movement mechanism on the basis of the thickness information of the mask acquired by the thickness information acquisition means.

Description

technical field [0001] The present invention relates to an alignment device, a film forming device, an alignment method, a film forming method, a manufacturing method of an electronic device, a recording medium, and a program. Background technique [0002] In recent years, organic EL display devices have attracted attention as flat panel display devices. As a self-luminous display, organic EL display devices are superior to liquid crystal panel displays in response speed, viewing angle, and thinner. They can quickly replace existing liquid crystal displays in monitors, televisions, and various portable terminals represented by smart phones. panel display. In addition, its application field has also expanded to automotive displays and the like. [0003] An organic light-emitting element (organic EL element; OLED) constituting an organic EL display device has a basic structure in which an organic material layer that emits light is formed between two opposing electrodes (cath...

Claims

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Application Information

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IPC IPC(8): C23C14/04C23C14/54H01L21/68H01L51/56
CPCC23C14/042C23C14/54H01L21/682H10K71/00H01L21/67294H01L21/67259H01L22/12H01L23/544H01L21/67282H01L21/67017H01L21/02631H01L21/67276H10K71/16C23C16/04G03F9/00
Inventor 小林康信菅原洋纪
Owner CANON TOKKI CORP
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