Perpendicular inductors integrated in a substrate

Abstract

Some features pertain to a substrate, and a first inductor integrated into the substrate. The first inductor includes a plurality of first inductor windings in a first metal layer and a second metal layer. A second inductor is integrated into the substrate. The second inductor includes a first spiral in a third metal layer. The first spiral is located at least partially inside the plurality of first inductor windings, wherein the second inductor is perpendicular to the first inductor.

Description

[0001] Cross References to Related Applications [0002] This patent application claims Provisional Application No. 62 / 629,345, filed February 12, 2018, entitled "PERPENDICULAR INDUCTORS INTEGRATED IN A SUBSTRATE," and filed January 23, 2019, entitled "PERPENDICULAR INDUCTORS INTEGRATED IN A SUBSTRATE" Priority of non-provisional application No. 16 / 254,735, assigned to the assignee herein and expressly incorporated herein by reference. technical field [0003] Various features relate to vertical inductors integrated in the substrate. Background technique [0004] Integrated circuits, substrates, and electronic devices are constantly being driven to smaller form factors. Devices such as inductors and duplexers are integrated into the substrate to save space. As the form factor of the substrate decreases, there are challenges in making the inductors and duplexers smaller. In addition, electromagnetic interference between such devices is also a challenge. [0005] Figure...

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Problems solved by technology

However, this is undesirable as it increases the electromagnetic interference between the first inductor 110, the second inductor 112 and the third inductor 114

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