Probe head and probe card

Abstract

This disclosure discloses a probe head, including an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface and a lower surface that are opposite to each other and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and the groove is provided with a groove bottom surface. In the first direction, the groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate and located on the side of the lower surface. The probe is provided with a probe tail, a probe body and a probe tip that are connectedin sequence, and the probe is disposed in the groove. In the first direction, an end portion of the probe tail is located between the groove bottom surface and the upper surface. This disclosure further discloses a probe card, including a circuit board, a space transformer and the probe head.

Description

technical field [0001] The invention relates to a probe head and a probe card. Background technique [0002] Semiconductor integrated circuit chips usually use probe cards for electrical testing. The probe card includes a printed circuit board, a space transformer (Space Transformer, ST) and a probe head (Probe Head, PH). The probe head mainly includes an upper guide plate, a lower guide plate and a plurality of probes. Each probe respectively comprises a needle tail, a needle body and a needle tip connected in sequence. The probe passes through the upper guide plate and the lower guide plate, the needle tail of the probe passes through the upper guide plate to contact the space transformer to form an electrical connection, and the needle tip of the probe passes through the lower guide plate to contact the object to be tested to form an electrical connection connect. [0003] As the application area of ​​the probe head becomes larger and larger, the parallelism of the up...

AI Technical Summary

Problems solved by technology

Therefore, when the probe head is placed on the space transformer, due to the difference in parallelism of the upper guide plate, the pressure between the needle tail of each probe and the space transformer also changes, and some probes may be damaged during the assembly process. under pressure

When the probes are over-pressurized, it may cause cracks where the probes pass through the upper guide plate, or even cause the probes to sink into the upper guide plate to form pin jams.

All of these will lead to the failure of the probe card to produce a test yield that is not as expected in the subsequent use

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