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Vertical UV light source hardening device and application method thereof

A vertical, light source technology, which is applied to the surface coating liquid device, pretreatment surface, coating, etc., can solve the problems of circuit board softening deformation, circuit bending deformation, etc., and achieve the effect of not being easily deformed

Pending Publication Date: 2020-10-13
GRP UP IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the UV hardening equipment in the prior art, the circuit board is placed horizontally above the rollers of the conveying mechanism. When the hardening process is carried out by the UV hardening equipment, the circuit board will be heated after the hardening equipment irradiates the circuit board with its light source. When the temperature rises, at this time, the circuit board will be softened and deformed due to the high temperature heating, which will cause the circuit board to be bent and deformed after the curing equipment hardens the protective layer. Defective products, this is the problem and shortcoming of the UV hardening equipment for circuit board processing in the prior art

Method used

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  • Vertical UV light source hardening device and application method thereof
  • Vertical UV light source hardening device and application method thereof
  • Vertical UV light source hardening device and application method thereof

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Embodiment Construction

[0024] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0025] see figure 1 As shown, the vertical UV light source curing device of the present invention includes a track 10, a conveying mechanism 20, a curing lamp group 30 and at least one carrier 40, wherein the rail 10, the conveying mechanism 20 and the curing lamp group 30 is set on a machine platform, the machine platform is the prior art, not shown in the figure, it can be used to provide the installation of each component, the carrier 40 can be detachably positioned on the conveying mechanism 20 and be carried and moved through the curing light set 30 .

[0026] Cooperate with reference Figure 2 to Figure 6 As shown, the track 10 has an upper space 101, a lower space 102, a front space 103 and a rear space 104, the track 10 has a track seat 11, the track seat 11 is installed on the machine, the upper The space 101 is fo...

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Abstract

The invention provides a vertical UV light source hardening device and an application method thereof. The vertical UV light source hardening device is provided with a rail arranged on the machine table; the rail is provided with a conveying mechanism; a chain of the conveying mechanism is movably positioned on the rail; and a curing lamp group is arranged at the outer side of the track and is provided with a plurality of lamps with lamp tubes and located at the two sides of the rail. Lamp tubes are vertically arranged, a to-be-cured and machined thin-plate workpiece is positioned by a bearingframe, and the bearing frame is arranged on the chain and enables the workpiece to be in a vertical state. Upon implementation of an operation, the workpiece is positioned on the bearing frame, the bearing frame is conveyed by the rail to pass through the space between the lamps of the fixed lamp sets so as to conduct curing operation. Due to the fact that the workpiece subjected to UV thermocuring is in a vertical state, it can be guaranteed that the workpiece in a thin plate shape cannot deform after being processed, heated and cured, and the effect of improving the percent of pass is achieved.

Description

technical field [0001] The invention relates to a circuit board processing machine, in particular to a vertical UV light source hardening device which uses a UV light source to perform surface hardening on a vertically passing circuit board. Background technique [0002] In the circuit board production process of the prior art, the protective layer coated on the circuit board must be dried and hardened by UV. The structure of the hardening equipment used is generally provided with a conveying mechanism and at least one irradiation mechanism on the body. The irradiating mechanism can be arranged above the conveying mechanism, or one irradiating mechanism is respectively arranged above and below the conveying mechanism, that is, the two irradiating mechanisms are respectively located above and below the conveying mechanism, and the conveying mechanism includes at least a plurality of roller groups and A transmission mechanism, each roller group is provided with a shaft and a p...

Claims

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Application Information

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IPC IPC(8): B05D3/06
CPCB05D3/067
Inventor 陈安顺
Owner GRP UP IND CO LTD