A high-voltage copper bar processing technology to overcome stamping slump

A processing technology and high-pressure technology, applied in the field of high-pressure copper bar stamping, can solve problems such as stamping collapse angle process defects

Active Publication Date: 2020-12-01
宁波峰梅精密科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a high-voltage copper bar processing technology that overcomes stamping slump angle, which can well solve the problem of stamping sag angle process defects existing in the above-mentioned existing high-voltage copper bar stamping process

Method used

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  • A high-voltage copper bar processing technology to overcome stamping slump
  • A high-voltage copper bar processing technology to overcome stamping slump
  • A high-voltage copper bar processing technology to overcome stamping slump

Examples

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Embodiment 1

[0036] A high-voltage copper bar 3 processing technology for overcoming stamping slump, comprising the following steps:

[0037] Product fixing: Fix the high-voltage copper bar 3 to the lower mold 2.

[0038] The processing technology of the high-voltage copper bar 3 also includes a pressing step 8 arranged after the product is fixed and before bending, and step marks are pressed on the outer edges of both ends of the high-voltage copper bar 3, and then the steps 8 are punched out along the pressed step marks.

[0039] The processing technology of the high-voltage copper bar 3 also includes setting the waist line 9 after the product is fixed and before bending, and the waist line 9 required by the product is punched out on both sides of the middle part of the high-voltage copper bar.

[0040] Bending: Utilize the pressing of the upper mold 1 and the lower mold 2 to bend the high-voltage copper bar 3 from the middle. At this time, the high-voltage copper bar 3 has a structure w...

Embodiment 2

[0053] This embodiment provides a high-voltage copper bar without sag produced by the above-mentioned processing technology.

[0054] refer to Figure 7 and Figure 8 , a high-voltage copper bar without slump, comprising a plate-shaped conductive body 11 and connecting parts 12 respectively arranged at both ends of the conductive body 11, the material of the conductive body 11 is metal, and preferably flexible copper, so as to facilitate For processing such as bending and stamping, the connection part 12 is provided with a horizontal connection surface, and the two sides of the connection part 12 are symmetrically provided with side end surfaces 13, and the side end surfaces 13 are arranged perpendicular to the connection surface. After being symmetrically stacked, it is fixed on the carrier and sealed with glue. The connecting part 12 is provided with a waist-shaped hole 16, and the connecting piece passes through the waist-shaped hole 16 and cooperates with the external car...

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Abstract

The invention provides a high-voltage copper bar processing technology for overcoming stamping slump, including the following steps: product fixing: fixing the high-voltage copper bar to the lower mold; bending: using the pressing of the upper mold and the lower mold, Bending from the middle, flattening: use the upper mold flattening punch to flatten the straight parts at both ends of the bent high-voltage copper bar; fine cutting: use the fine-cutting punch to flatten the two ends of the high-voltage copper bar after the flattening step The straight part is fine-cut; the product falls: the high-voltage copper bar that has been fine-cut and deburred is taken out from the lower mold. The high-voltage copper bar processing technology provided by the present invention to overcome the punching slump angle adopts the fine cutting process after the high-voltage copper bar is flattened and thinned, and the fine cutting will cut off the outwardly extending part vertically, effectively avoiding The problem of slump angle; finally, when injecting glue, it not only avoids glue running, but also fully guarantees the contact area of ​​high-voltage copper bars, thereby ensuring the electrical performance of high-voltage copper bars after glue injection.

Description

technical field [0001] The invention relates to the field of stamping of high-voltage copper bars, in particular to a high-voltage copper bar processing technology for overcoming stamping slump. Background technique [0002] High-voltage copper bars are important accessories in new energy vehicles. Generally, high-voltage copper bars need to be used in combination with injection glue. There are many problems with glue. [0003] In the existing ordinary stamping manufacturing of high-voltage copper bars, there will be a process defect of stamping sag in the front of the stamping direction of the stamping cut edge of the stamped product; and the existence of stamping slump will lead to insert injection molding of high-voltage copper bars. When the sealant overflows and the contact area of ​​the high-voltage copper busbar decreases, it will affect the performance of the high-voltage copper busbar after insert injection molding. Contents of the invention [0004] (1) Technic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21D5/02B21D28/26B21D35/00
CPCB21D5/02B21D28/26B21D35/001B21D35/002
Inventor 杨伟章德道陈彬
Owner 宁波峰梅精密科技有限公司
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