Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Support structure generation method and device, electronic equipment and storage medium

A technology of support structure and support area, which is used in electrical digital data processing, computer-aided design, details involving 3D image data, etc. It can solve the problem of low printing success rate, achieve uniform distribution, simplify the calculation process, and avoid leakage Check the effect

Pending Publication Date: 2020-10-30
SHENZHEN ANYCUBIC TECH CO LTD
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present disclosure provides a support structure generation method, device, electronic equipment and storage medium to solve the problem of low printing success rate in the support structure generation method in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Support structure generation method and device, electronic equipment and storage medium
  • Support structure generation method and device, electronic equipment and storage medium
  • Support structure generation method and device, electronic equipment and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Exemplary embodiments of the present application are described below in conjunction with the accompanying drawings, which include various details of the embodiments of the present application to facilitate understanding, and they should be regarded as exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the application. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

[0035] see figure 1 , figure 1 is one of the flow charts of the supporting structure generating method provided by the embodiment of the present application, such as figure 1 As shown, this embodiment provides a method for generating a support structure, including the following steps:

[0036] Step 101, acquiring a triangular mesh model of an object to be printed....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a supporting structure generation method and device, electronic equipment and a storage medium, and relates to the technical field of printing. According to the invention, thespecific implementation scheme is that the method comprises the steps: acquiring a triangular mesh model of a to-be-printed object; determining a target triangular plate in the triangular mesh model according to the position information of the triangular plate of the triangular mesh model; determining a first to-be-supported area and a second to-be-supported area of the triangular mesh model according to the area of the target triangular plate; obtaining a first target sampling point in the first to-be-supported area and a second target sampling point in the second to-be-supported area; and generating a support structure for supporting the triangular mesh model based on the target sampling point. Since the target sampling points are obtained separately according to the area of the target triangular plate, the target sampling points can be distributed uniformly, the possibility of missing detection of a tiny support area in the model is avoided, and the printing success rate is improved.

Description

technical field [0001] The invention belongs to the technical field of printing, and in particular relates to a support structure generation method, device, electronic equipment and storage medium. Background technique [0002] Three Dimensiona (3D for short) printing technology is a new type of rapid prototyping technology based on digital models. It manufactures models by layer-by-layer printing. It is a molding technology completely different from traditional mold manufacturing. The process of 3D printing is to first divide the digital model into several layer slices according to the specified layer height, and print layer by layer from low to high. Each layer is superimposed on the basis of the previous layer. If the current If the upper layer of the layer is empty, the current layer cannot be supported, and the printing will fail at this position. [0003] At present, the support structure generation method based on 3D printing generally slices and layers the 3D model,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/10G06T17/20G06F113/10
CPCG06F30/10G06T17/20G06F2113/10G06T2200/04
Inventor 谢育钢欧阳欣
Owner SHENZHEN ANYCUBIC TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com