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Transfer device and transfer method

A transfer device and transfer head technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting the adsorption force, unable to transfer MicroLED at a fixed point, etc., and achieve the effect of full contact

Active Publication Date: 2022-03-29
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to their respective defects, the existing Micro LED transfer heads cannot transfer Micro LEDs reliably, at fixed points, quickly and cheaply.
[0004] For example, in the traditional electrostatic transfer head, the distance between the electrostatic transfer head and the suctioned target seriously affects the size of its adsorption force

Method used

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0029] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the pr...

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Abstract

The invention discloses a transfer device and a transfer method. The transfer device includes a substrate and at least one transfer head arranged on the substrate. The transfer head includes: an adsorption device and a magnetic field generating device, wherein the magnetic field generating device It is used to generate a magnetic field to adsorb magnetic particles to form a contact layer in the adsorption area, and the adsorption device adsorbs the Micro LED on the surface of the contact layer; the transfer device and transfer method of the present invention can enable the Micro LED to Being fully contacted by the magnetic particles can overcome the problem in the traditional electrostatic transfer head that the distance between the transfer head and the sucked target seriously affects the size of the adsorption force.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a transfer device and a transfer method. Background technique [0002] In the micro-light-emitting diode display manufacturing process, transferring the Micro LED from the intermediate carrier plate to the TFT substrate for bonding between the Micro LED and the TFT substrate is a very critical step. In addition, for the Micro LEDs that are abnormally lit after bonding on the TFT substrate, it is necessary to remove the abnormal Micro LEDs at fixed points. [0003] Therefore, efficient Micro LED transfer tools are required to complete the transfer reliably, accurately, quickly and cheaply. However, due to their respective defects, the currently existing Micro LED transfer heads cannot transfer Micro LEDs in a reliable, fixed-point, fast, and cheap manner. [0004] For example, in a traditional electrostatic transfer head, the distance between the electrostatic transfer head and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L33/48
CPCH01L21/6835H01L33/48H01L2933/0033H01L2221/68368
Inventor 卢马才
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD