Impact-force-free thimble device of die bonder and working method thereof

Abstract

The invention discloses an impact-free thimble device of a die bonder and a working method thereof, the impact-free thimble device of the die bonder comprises a base, a thimble, a thimble driving mechanism, a thimble cap and a thimble cap driving mechanism, the thimble cap is mounted at the top of the base, and a vacuum hole is formed in the thimble cap; the thimble cap driving mechanism is mounted at the bottom of the thimble cap and used for controlling the thimble cap to move; the thimble is installed in the vacuum hole in the thimble cap, and the thimble driving mechanism is installed on the base, located at the bottom of the thimble and used for controlling the thimble to move. According to the thimble device, the mode that the crystal film is separated from the wafer is adopted, theinitial height of the thimble is accurately and conveniently adjusted, the mode that the thimble cap descends is adopted, and in the process that the crystal film is separated from the wafer, the impact force of the thimble on the wafer is smaller, the wafer suction precision is higher, the quality is better, and the efficiency is higher.

Description

technical field [0001] The invention relates to the technical field of crystal bonding machines, in particular to a non-impact thimble device of a crystal bonding machine and a working method thereof. Background technique [0002] The thimble device is a common device in the automatic die bonding machine in the LED semiconductor industry. It plays the role of separating the wafer from the crystal film. Because the chip is very small and fragile, and the speed of the die bonder is getting faster and faster, the positional accuracy and response speed of the thimble device are increasingly required. The process of using suction nozzle and thimble to separate the wafer from the crystal film is also called the crystal suction process. In the traditional crystal suction process, the thimble mechanism uses a thimble to lift the wafer to separate the wafer from the crystal film. During the separation process, the thimble must continue to go up. After the thimble is lifted, pressure...

AI Technical Summary

Problems solved by technology

With the existing control technology, it has been unable to solve the problem of controlling or suppressing the damage of the wafer caused by the pressure caused by the separation of the wafer and the crystal film under the condition of increasingly high-speed motion

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