Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor process equipment and integrated gas supply system thereof

A gas supply system and process equipment technology, applied in metal material coating process, gaseous chemical plating, coating, etc., can solve the problems of difficult disassembly and maintenance, poor versatility, etc., to reduce application and maintenance costs, and improve versatility Sexuality, avoid the effect of high degree of customization

Active Publication Date: 2020-11-17
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD +1
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the shortcomings of the existing methods, this application proposes a semiconductor process equipment and its integrated gas supply system to solve the technical problems of poor versatility and difficult disassembly and maintenance in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor process equipment and integrated gas supply system thereof
  • Semiconductor process equipment and integrated gas supply system thereof
  • Semiconductor process equipment and integrated gas supply system thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0023] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides semiconductor process equipment and an integrated gas supply system thereof. The integrated gas supply system is arranged between a gas source and a process chamber of the semiconductor process equipment, is used for conveying gas into the process chamber, and comprises a plurality of gas path conveying modules which are detachably connected with one another; each gas path conveying module comprises a first base block and first control parts, and a first gas path is formed in the first base block; and at least one first control part is arranged on the first base block and connected with the first gas path. According to the integrated gas supply system, the gas path conveying modules can be randomly combined to adapt to different types of semiconductor process equipment, so that the overall universality is greatly improved, and the problem of the high customization degree is avoided. In addition, when a certain gas path conveying module is contaminated, only the gas path conveying module needs to be replaced independently, and therefore the application and maintenance cost is greatly reduced.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor process equipment and an integrated gas supply system thereof. Background technique [0002] At present, with the development of the integrated circuit industry, stricter requirements are imposed on the volume and floor space of semiconductor process equipment. Therefore, the integrated gas supply system is generally used as the gas supply system of semiconductor process equipment in the prior art. The integrated gas supply system can include 14 gas paths. Except for the gas path for purging, the process gas in each gas path passes through multiple components set on each gas path in turn, and then is divided into two paths after being aggregated. One way enters the pump body of the semiconductor process equipment, and the other way enters the process chamber. Although the existing integrated gas supp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/455C23C16/52
CPCC23C16/45574C23C16/52
Inventor 郑波魏景峰杨宗林苏乾益宋志辉
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com