Heat dissipation system and cooling liquid distribution module thereof

Abstract

The invention provides a heat dissipation system and a cooling liquid distribution module thereof which are applied to a plurality of electronic components of electronic computer equipment, and the heat dissipation system comprises a plurality of water cooling heads, a radiator and a cooling liquid distribution module. The plurality of water cooling heads are correspondingly arranged on the plurality of electronic components respectively. The radiator exchanges heat with the fluid medium passing through the radiator. The cooling liquid distribution module is connected between the plurality ofwater cooling heads and the radiator. The cooling liquid distribution module comprises a module body and a power module. The module body comprises a cold water cavity. The cold water cavity is provided with a plurality of first liquid outlets, and the first liquid outlets correspond to the water cooling heads respectively. The power module is arranged in the module body and drives the fluid mediumto flow out of the multiple first liquid outlets such that the fluid medium circularly flows in the multiple water cooling heads, the radiator and the cooling liquid distribution module. Therefore, the invention can be applied to the electronic computer equipment with a relatively narrow space.

Description

technical field [0001] The present invention relates to a cooling system, in particular to a cooling system with a cooling liquid distribution module and the cooling liquid distribution module. Background technique [0002] With the advancement and popularization of science and technology, various electronic devices or computer equipment have already become indispensable in people's daily life, such as notebook computers, desktop computers, network servers and so on. Generally speaking, the electronic components inside these products will increase in temperature during operation, and high temperature will easily cause damage to the components. Therefore, the heat dissipation mechanism is a very important and necessary design for these electronic products. The general cooling design includes using fans to provide airflow for convection cooling, or attaching heat dissipation units made of special materials to generate conduction cooling. In addition, the water-cooling mechani...

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Problems solved by technology

[0006] However, in the above-mentioned water-cooled heat dissipation system used on server equipment, the coolant distribution device must use a set of external circulation to achieve the purpose of heat exchange and use the manifold device to achieve the purpose of evenly distributing the coolant to each cold plate. This will cause the entire heat dissipation system to be too bulky, and cannot be used in electronic equipment (such as a host computer of a personal computer) with a relatively narrow internal space. Therefore, how to improve this problem is really the concern of relevant personnel in the field. Focus

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