A design method for equal-length wiring of mcu and sdram in bga package
A design method and equal-length wiring technology, applied in the direction of computer design circuit, printed circuit production wiring diagram, printed circuit, etc., can solve the problems of occupying a large PCB area, easy to overthrow and restart, and high difficulty, and reduce the PCB area. , The effect of large space utilization and orderly planning
Active Publication Date: 2021-08-03
ZHEJIANG LAB
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] The purpose of the embodiment of the present invention is to provide a BGA-packaged MCU and SDRAM equal-length wiring design method to solve the existing problems of MCU and SDRAM equal-length wiring that are difficult, time-consuming, occupy a large PCB area, and are easy to overthrow halfway.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0025] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0026] refer to figure 1 , the embodiment of the present invention provides a BGA-packaged MCU and SDRAM equal-length wiring design method, including:
[0027] Step S101, grouping pad pairs that need to be interconnected between the MCU and the SDRAM and have the same electrical network;
[0028] Specifically, the pad pairs that need to be interconn...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a BGA-packaged MCU and SDRAM equal-length wiring design method, which includes: grouping pad pairs that need to be interconnected between the MCU and SDRAM and have the same electrical network; Plan the wiring channels in parallel directions, wherein the spacing between the wiring channels is equal, and ensure that the vias and the wiring will not interfere; according to the grouping of the pad pairs of the same electrical network, the planned wiring channels are allocated; according to the wiring channels The allocation of the pad pairs of the same electrical network is completed. Each trace has one and only two vias, which can achieve more accurate equal-length matching; the original length of all traces is the closest, thus greatly reducing the workload of subsequent serpentine traces for equal-length matching; The overall direction of the layer wiring is consistent, and the space utilization rate is the largest, thereby reducing the PCB area occupied by the entire wiring; the wiring thinking is clearer, the planning is more orderly, and the wiring efficiency is greatly improved.
Description
technical field [0001] The invention relates to the technical field of circuit board design, in particular to a BGA-packaged MCU and SDRAM equal-length wiring design method. Background technique [0002] When designing an MCU, it is often necessary to configure an off-chip SDRAM as an extension. Due to the high speed of data transmission, in order to prevent the timing misalignment caused by the transmission delay on the wire, the data lines, address lines and control lines between the MCU and SDRAM Lines need to be matched in equal lengths, which is often a time-consuming task. If there is a lack of correct wiring ideas and planning, it is easy to find that the wiring work has to be reinvented in the middle of the process, resulting in a serious waste of time. Contents of the invention [0003] The purpose of the embodiment of the present invention is to provide a BGA-packaged MCU and SDRAM equal-length wiring design method to solve the existing problems of MCU and SDRAM ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0002H05K3/0005
Inventor 王培磊杨汶佼吕炜
Owner ZHEJIANG LAB