Copper soft connection structure and lithium-ion battery negative electrode copper tab structure and preparation method
A lithium-ion battery and connection structure technology, which is applied in the direction of connection, structural parts, secondary batteries, etc., can solve the problems that the bending resistance needs to be further improved, the process is difficult, and the cost is high, so as to improve the bending resistance and ultrasonic welding. The effect of improving the quality and bending resistance
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[0063] In view of the above problems, some embodiments of the present application provide a method for preparing the above-mentioned low-hardness copper material 110, including: annealing raw copper in the presence of an inert gas to obtain the low-hardness copper material; wherein, the The annealing temperature is 800-1000° C., the holding time is less than 2 hours, and the number of crystal domains per square centimeter of the raw copper is >100.
[0064] The inventor found in the research that when the annealing temperature is increased to above 1000°C during the recrystallization process, the hardness of the copper strip will continue to decrease. By increasing the annealing temperature, a copper strip with a Vickers hardness less than 50Hv can be obtained. As the thickness of the copper strip decreases, its hardness also decreases. When the copper strip is annealed and recrystallized at the above temperature, although the hardness of the copper strip tends to decrease gra...
Embodiment 1
[0092] A copper soft connection structure is provided, which is prepared according to the following steps:
[0093] (1) Using electrolytic copper foil as a raw material, the electrolytic copper foil is annealed under nitrogen condition, the annealing temperature is 1000° C., and the holding time is 1 hour to obtain a low-hardness copper material. The copper content in the low-hardness copper material is >99.96wt%, the copper crystal domain is a large crystal domain, the number of crystal domains per square centimeter is less than 20, and the maximum crystal domain length range is 80mm; each crystal domain has Cu(111 ), Cu(110), Cu(211), Cu(100) one of the lattice orientations. The low-hardness copper material has a Vickers hardness of 20Hv and a thickness of 0.01mm; after being bent at 90° for 3-7 times, the Vickers hardness is 39HV.
[0094] (2), after stacking the 5 sheets of low-hardness copper materials obtained in step (1), weld them at both ends, so that multiple sheets...
Embodiment 2
[0097] A copper flexible connection structure is provided, the preparation steps of which are basically the same as in Example 1, except that the Vickers hardness of the low-hardness copper material is 40Hv, and the thickness is 0.01mm; after bending 3-7 times at 90° , Vickers hardness 50HV.
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