Chip test device, system and method

Abstract

The invention provides a chip test device, system and method, and relates to the technical field of semiconductors, the device comprises a power supply plug-in mounting circuit board, a device test circuit board, device plug-in mounting circuit boards and connecting pieces; the power supply plug-in circuit board is in communication connection with the device test circuit board; the device test circuit board is in communication connection with the plurality of device plug-in mounting circuit boards through the plurality of connecting pieces. The device plug-in mounting circuit boards are used for being in communication connection with a to-be-tested chip, obtaining test parameters of the chip to be tested and sending the test parameters to the device test circuit board through the connecting pieces. The device test circuit board is used for receiving the test parameters and sending the test parameters to the test module, so that the test module generates a chip test result. According tothe invention, the plurality of to-be-tested chips can be simultaneously connected through the plurality of device plug-in mounting circuit boards, the test parameters of the chip test process are obtained, the operation is simple, the test efficiency is high, and the device is suitable for chip test of various products.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip testing device, system and method. Background technique [0002] The working life of the chip can be estimated by the method of temperature-accelerated aging. Applying voltage at a certain temperature is a harsh working method. Under the action of temperature and electric field, poor-quality devices will fail. This method can Judging the manufacturing level of chips can also be used to judge the quality of production batches. The high-temperature aging test of the chip, in the terminal product, is often welded into the product for product performance testing, so as to reverse the performance test results of the chip through the product test results. This test method is slow in efficiency, difficult to operate, and welding To test in the product, it takes up equipment space, and it is not suitable for product testing with too many chips. Contents of the invention ...

AI Technical Summary

Problems solved by technology

The high-temperature aging test of the chip, in the terminal product, is often welded into the product for product performance testing, so as to reverse the performance test results of the chip through t

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