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Temperature relay circuit and chip

A temperature relay and circuit technology, applied in relays, circuits, electrical components, etc., can solve the problems of slow switching speed, low precision, and large volume, and achieve the effect of solving complex structures

Active Publication Date: 2020-12-18
SHANGHAI XINLONG SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a temperature relay circuit and chip to solve the problems of complex structure, large volume, slow switching speed, high power consumption and low precision of the temperature relay in the prior art

Method used

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  • Temperature relay circuit and chip

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Embodiment Construction

[0024] In order to make the purpose, advantages and features of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in very simplified form and not drawn to scale, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention. In addition, the structures shown in the drawings are often a part of the actual structures. In particular, each drawing needs to display different emphases, and sometimes uses different scales.

[0025]As used in the present invention, the singular forms "a", "an" and "the" include plural objects, the term "or" is usually used in the sense of including "and / or", and the term "several" Usually, the term "at least one" is used in the meaning of "at least one", and the term "at least two" is usually used in the meaning of "two or more". In a...

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PUM

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Abstract

The invention provides a temperature relay circuit and a chip. The temperature relay circuit comprises a temperature detection module, and the temperature detection module comprises a first temperature detection unit, a second temperature detection unit and a third temperature detection unit; the first temperature detection unit is used for providing reference voltage; the second temperature detection unit comprises a temperature sensing element, and the temperature sensing element is configured in the mode that the turn-on voltage of the temperature sensing element is reduced along with rising of the environment temperature; when the turn-on voltage of the temperature sensing element is smaller than or equal to the reference voltage, the second temperature detection unit is turned on, andotherwise the second temperature detection unit is turned off; the third temperature detection unit is configured to raise the reference voltage and output a first level when the second temperature detection unit is turned on. Due to the configuration, the basic functions of the temperature relay can be realized, and the problems of complex structure, large size, low switching speed, high power consumption and low precision of the temperature relay in the prior art are solved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit chips, in particular to a temperature relay circuit and a chip. Background technique [0002] The temperature relay is a relay that operates when the external temperature reaches a set value. It can be used in aerospace, surveillance camera equipment, motors, electrical equipment and power battery thermal management systems. Most of the temperature relays on the market are contact temperature relays and electromagnetic switch temperature relays. [0003] Contact temperature relay, two metals or alloys with different thermal expansion coefficients are firmly combined to form a disc-shaped bimetallic sheet. When the temperature rises to a certain value, the bimetallic sheet will expand and elongate due to the expansion of the underlying metal. The expansion and elongation of the upper layer of metal is small to produce an upward bending force, and when the bending reaches a certain degr...

Claims

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Application Information

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IPC IPC(8): H01H47/00
CPCH01H47/001H01H47/002
Inventor 李瑞平池伟王建虎刘彬
Owner SHANGHAI XINLONG SEMICON TECH CO LTD