Encapsulation structure with dam and manufacturing method thereof

Abstract

The invention discloses a manufacturing method of a package structure with a dam, comprising the steps of: preparing a temporary carrier board, and preparing a dielectric layer on the temporary carrier board, wherein a first wiring layer and a first wiring layer located in the first wiring layer are arranged in the dielectric layer Conduction pillars on the upper surface of the wiring layer; prepare a second wiring layer on the outer surface of the dielectric layer, and the second wiring layer and the first wiring layer are conductively connected through the conductive pillars; A first solder resist layer and a second solder resist layer are respectively formed on the upper and lower surfaces; a dam is made on the outer surface of the first solder resist layer; the first solder resist layer and the second solder resist layer are respectively subjected to metal surface treatment; The solder resist layer is a surface mount device, wherein the terminals of the device are connected to the second wiring layer, and the packaging material is laminated to form a packaging layer to cover the surrounding dam and the device. Also disclosed is an encapsulation structure with a dam, including the dam and a device arranged in the space enclosed by the dam.

Description

Technical field [0001] The present invention relates to an electronic device having a dam package structure, and is specifically related to a package structure having a dam and a method of manufacturing the same. Background technique [0002] The existing device encapsulated embedded technology When the device is encapsulated, most of them use the package substrate mounting device to perform plastic treatment. Normally, the package substrate is complex during the manufacturing process, the process is longer, the method of the package substrate is about 95%, and the relevant substrate manufacturer is labeled with the substrate units after the end of the substrate manufacturing, and the bad unit is poor mark. The post-order vendor recognizes poor, avoiding the mount of bad areas, and reducing the unnecessary waste of materials. [0003] However, the filter such as the filter or the like for high gas tightness and reliability, if the package substrate is selected according to the ad...

AI Technical Summary

Problems solved by technology

[0003] However, for products with high airtightness and reliability, such as filters, if the packaging substrate is selectively mounted according to the bad mark, when the plastic sealing material is attached to the plastic package, the amount of glue filling will change due to the number of devices, and the plastic package The relative flow of materials to the non-device area will cause abnormalities such as voids and less glue in the peripheral area of ​​​​the non-mounted device, resulting in abnormal scrapping of the peripheral connected area

Therefore, in order to ensure the stability of the amount of glue filling, when such products are subsequently mounted into plastic packages, devices are generally mounted on the entire board without identifying the yield of the substrate, resulting in a certain proportion of devices being directly wasted, resulting in a large waste of resources and waste of cost

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