A control method and motherboard system for automatically loading heat dissipation parameters

A technology of automatic loading and control methods, applied in hardware monitoring, electrical digital data processing, digital data processing components, etc., can solve the problems that the processor cannot be used universally and the designers are inconvenient, so as to reduce the development workload, achieve heat dissipation and High performance and versatility

Active Publication Date: 2022-06-21
SHENZHEN WEIBU INFORMATION
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Problems solved by technology

The traditional method only configures a set of DPTF parameters (the mechanism used to improve heat dissipation and performance), which is not universal for processors with different thermal design power consumption, and can only configure parameters for each thermal design power consumption, causing designers Inconvenient, but also a risk for users who need to replace the CPU

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  • A control method and motherboard system for automatically loading heat dissipation parameters
  • A control method and motherboard system for automatically loading heat dissipation parameters
  • A control method and motherboard system for automatically loading heat dissipation parameters

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Embodiment Construction

[0017] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

[0018] see figure 1 , an embodiment of a control method for automatically loading heat dissipation parameters in the embodiment of the present invention includes:

[0019] Step S10, acquiring the TDP power consumption of the current electronic device. The electronic device of the present invention includes a computer, and the electronic device can work with TDP power consumption (Thermal Design Power, thermal design power consumption), so that...

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Abstract

The embodiment of the present invention discloses a control method for automatically loading heat dissipation parameters and a motherboard system. The method includes: obtaining the TDP power consumption of the current electronic device; The heat dissipation type of the device; call the DPTF heat dissipation parameter corresponding to the value according to the value of the preset flag bit, control the temperature of the electronic device according to the DPTF heat dissipation parameter, and call the first DPTF when the value of the preset flag bit is the first value Heat dissipation parameter, when the value of the preset flag is the second value, the second DPTF heat dissipation parameter is called, and the present invention can load the corresponding DPTF heat dissipation parameter according to different TDPs, without replacing processors with different TDPs, to achieve heat dissipation and performance balance.

Description

technical field [0001] The invention relates to the field of computer heat dissipation control, in particular to a control method and a motherboard system for automatically loading heat dissipation parameters. Background technique [0002] As the current notebook computer market increasingly favors ultra-thin designs, notebooks generate a lot of heat in a limited space, which, if not effectively controlled, will seriously degrade device performance. The traditional method only configures one set of DPTF parameters (mechanism for improving heat dissipation and performance), which is not universal for processors with different thermal design power consumption, and can only configure parameters for each thermal design power consumption separately, which will cause designers trouble. Inconvenient, but also a risk to users who need to replace the CPU. SUMMARY OF THE INVENTION [0003] In view of the above technical problems, embodiments of the present invention provide a contr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20G06F11/30
CPCG06F1/206G06F11/3024G06F11/3058Y02D10/00
Inventor 丁永波黄建新张振
Owner SHENZHEN WEIBU INFORMATION
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