The application discloses a heat dissipation structure of a
memory module and an
integrated circuit package, which comprises two air pipes, the two air pipes are arranged side by side along an axial direction, the two air pipes are communicated with each other through a connecting
pipe, and the
airflow directions in the two air pipes are opposite, a
chip assembly is arranged between the two air pipes, the
chip assembly comprises a plurality of
semiconductor wafers, a plurality of heat pipes are fixedly installed between adjacent
semiconductor wafers, two heat evenly plates are fixedly connected to two ends of each
heat pipe, and the two heat evenly plates are embedded in the side walls of the corresponding air pipes, and an
airflow dynamic adjusting mechanism is assembled on the air
pipe, the
airflow dynamic adjusting mechanism can adaptively adjust the airflow speed according to the
air volume, the
convection heat exchange efficiency is strengthened, the air duct
diameter is adaptively adjusted by relying on the pure mechanical structure, the
Venturi effect and the horn mouth flow guide structure are combined, the heat exchange is dynamically strengthened, the low air resistance and low
energy consumption are considered, and the heat dissipation performance of the
memory module is obviously improved.