Fingerprint imaging assembly, fingerprint imaging module and electronic equipment
An imaging component and imaging module technology, applied in the field of image capture, can solve problems such as the complex structure of the collimation layer, and achieve the effect of reducing crosstalk
Active Publication Date: 2020-12-29
FUZHOU ROCKCHIP SEMICON
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Problems solved by technology
[0003] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a fingerprint imaging component, a fingerprint imaging module and an electronic device, which are used to solve the problem that the prior art mainly relies on the collimation ability of the collimation layer to realize stray light filtering out, which leads to the problem that the structure of the collimation layer is more complicated
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[0056] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
[0057] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "upper"...
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The invention provides a fingerprint imaging assembly, a fingerprint imaging module and electronic equipment. The fingerprint imaging assembly comprises a collimation layer and an image sensor arranged on one side of the collimation layer; wherein the collimation layer comprises a light-transmitting unit array; the light-transmitting unit array is composed of a plurality of light-transmitting units and used for focusing light reaching the light-transmitting unit array to form converged light. The image sensor comprises a photosensitive unit array composed of a plurality of photosensitive units; the photosensitive unit array forms a field diaphragm of the convergent light; the photosensitive unit is used for imaging according to the received convergent light; the non-photosensitive area isused for absorbing light reaching the non-photosensitive area; and the substrate is used for bearing the photosensitive unit array and the non-photosensitive area. According to the fingerprint imagingassembly, stray light can be filtered through the image sensor and the collimation layer, the structure of the collimation layer can be simplified, and the processing difficulty of the collimation layer can be reduced.
Description
technical field [0001] The invention belongs to the field of image capture, and relates to an imaging component, in particular to a fingerprint imaging component, a fingerprint imaging module and electronic equipment. Background technique [0002] After the popularity of the concept of full-screen mobile phones, the fingerprint recognition technology under the screen has become the standard configuration of full-screen mobile phones. The so-called off-screen fingerprint recognition technology is a new technology that completes the fingerprint recognition and unlocking process through the bottom of the screen glass. In the existing solutions, the fingerprint recognition under the screen is mainly realized through the fingerprint imaging module, and the fingerprint imaging component as an important part of the fingerprint imaging module mainly includes a collimation layer and an image sensor. Wherein, the collimation layer is used to collimate the light reflected by the finge...
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IPC IPC(8): G06K9/00G06K9/20
CPCG06V40/13G06V10/147
Inventor 倪强
Owner FUZHOU ROCKCHIP SEMICON