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Testing device of integrated circuit with antenna in package

A testing device and integrated circuit technology, applied in electronic circuit testing, measuring devices, measuring electricity and other directions, can solve problems such as increasing production and operation costs and enterprise burdens

Pending Publication Date: 2021-01-08
CHUNGHWA PRECISION TEST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is to say, for the measurement of different IC products, two different systems must be provided to test the pin signal and wireless signal of the IC, which increases the cost of production and operation and creates a burden on the enterprise

Method used

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  • Testing device of integrated circuit with antenna in package
  • Testing device of integrated circuit with antenna in package
  • Testing device of integrated circuit with antenna in package

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Embodiment Construction

[0018] In order to make the above and other objectives, features, and advantages of the present disclosure more comprehensible, preferred embodiments of the present disclosure will be exemplified below in detail with reference to the attached drawings.

[0019] Please refer to figure 1 and figure 2 ,in figure 1 a schematic diagram showing the AiP IC testing device 1 of the first preferred embodiment of the present disclosure before stressing, and figure 2 show figure 1 Schematic diagram of the AiP IC test setup 1 after stress. In this disclosure, the AiP IC testing device 1 is preferably set up in an over-the-air (OTA) chamber system for measuring the AiP IC 10 that meets any wireless standard or Protocol signals, including but not limited to WiFi (IEEE802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, long term evolution (LTE), EV-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM , GPRS, CDMA, TDMA, DECT, Bluetooth, its derivatives, and signals specified as 3G, 4G, 5G, and an...

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PUM

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Abstract

The invention provides a testing device of an integrated circuit with antenna in package (AiP IC). The testing device comprises a carrier plate, a test seat arranged on the carrier plate and used forbearing an AiP IC emitting a wireless signal, and a receiving antenna circuit board adjacent to the test seat and used for receiving the wireless signal.

Description

technical field [0001] The disclosure relates to a test device for an integrated circuit with antenna package (AiP IC), in particular to a test device capable of measuring wireless signals sent by the AiP IC. Background technique [0002] With the development of electronic products toward precision and multi-functionality, the structure of ICs used in electronic products also tends to be complex. For example, integrated circuits (ICs) become more and more complex using antenna in package (AiP) technology. In order to verify the performance of the AiP IC, it is necessary to use an over-the-air (OTA) method to test the AiP IC components, and the existing wired measurement method is not enough. That is to say, for the measurement of different IC products, two different systems must be provided to test the pin signal and wireless signal of the IC, which increases the cost of production and operation and creates a burden on the enterprise. In view of this, it is necessary to pr...

Claims

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2887G01R31/2896
Inventor 陈世宗王伟丞
Owner CHUNGHWA PRECISION TEST TECH