Developing solution temperature control device and temperature control method thereof

A technology of temperature control device and developing solution, which is applied in temperature control, photography, non-electric variable control, etc. It can solve the problems of inaccurate temperature control, low temperature control sensitivity, and easy deviation.

Pending Publication Date: 2021-01-19
江苏晋誉达半导体股份有限公司
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the production process of semiconductor chips, developers and photoresists need to be used, and there are very strict requirements on the temperature of developers and photoresists, generally at 23 ± 0.1 degrees Celsius; The temperature control device is to install an electric heating device directly at the front end of the developer supply pipe, use the electric heating device to

Method used

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  • Developing solution temperature control device and temperature control method thereof
  • Developing solution temperature control device and temperature control method thereof
  • Developing solution temperature control device and temperature control method thereof

Examples

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Embodiment Construction

[0031] The present invention will be described in further detail below through specific examples.

[0032] Such as Figure 1 to Figure 5 As shown, a developer solution temperature control device includes a developer solution supply pipe 5, the developer solution supply tube 5 is connected to a developer solution storage bottle 2, and the developer solution storage bottle 2 is used to store the developer solution. Correspondingly, the developer solution supply A delivery pump (not shown) is provided on the pipe 5 to provide the power for the developer to flow.

[0033] The temperature control device also includes a first heat exchange tee joint 7, a second heat exchange tee joint 8 and a heat exchange sleeve 6, and the first heat exchange tee joint 7 is provided with a first through The nozzle 71, the first connection nozzle 72 and the heat exchange medium injection nozzle 73, the second heat exchange tee joint 8 is provided with the second through nozzle, the second connectio...

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Abstract

The present invention discloses a developing solution temperature control device and a temperature control method thereof. The device comprises a developing solution supply pipe, a first heat exchangethree-way joint, a second heat exchange three-way joint and a heat exchange sleeve, the heat exchange sleeve sleeves the developing solution supply pipe, the developing solution supply pipe sequentially penetrates through the first heat exchange three-way joint and the second heat exchange three-way joint, and one end of the heat exchange sleeve is hermetically inserted and fixed in a first connecting pipe orifice; the other end of the heat exchange sleeve is hermetically inserted and fixed in a second connecting pipe orifice, a heat exchange medium supply pipe is hermetically inserted in a heat exchange medium injection pipe orifice, a heat exchange medium outflow pipe is hermetically inserted in a heat exchange medium outflow pipe orifice, and the heat exchange medium supply pipe and the heat exchange medium outflow pipe are respectively connected with a temperature adjustment and heat exchange device for adjusting the temperature of the heat exchange medium. According to the temperature control device and method, the temperature of the developing solution can be adjusted more accurately.

Description

technical field [0001] The invention relates to a temperature control device for developing solution, and also relates to a temperature control method using the temperature control device. Background technique [0002] In the production process of semiconductor chips, developers and photoresists need to be used, and there are very strict requirements on the temperature of developers and photoresists, generally at 23 ± 0.1 degrees Celsius; The temperature control device is to install an electric heating device directly at the front end of the developer supply pipe, use the electric heating device to heat the developer in the developer supply pipe, and then use the cooling device outside the developer supply pipe to cool the developer , this structure leads to relatively low sensitivity of temperature control, and the temperature control may also be inaccurate, prone to deviation, especially when the flow rate of the developer fluctuates, the accuracy of temperature control is...

Claims

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Application Information

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IPC IPC(8): G03F7/30G05D23/20
CPCG03F7/30G03F7/3057G03F7/3064G05D23/20
Inventor 蒋磊许愿
Owner 江苏晋誉达半导体股份有限公司
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