Developing solution temperature control device and temperature control method thereof

Abstract

The present invention discloses a developing solution temperature control device and a temperature control method thereof. The device comprises a developing solution supply pipe, a first heat exchangethree-way joint, a second heat exchange three-way joint and a heat exchange sleeve, the heat exchange sleeve sleeves the developing solution supply pipe, the developing solution supply pipe sequentially penetrates through the first heat exchange three-way joint and the second heat exchange three-way joint, and one end of the heat exchange sleeve is hermetically inserted and fixed in a first connecting pipe orifice; the other end of the heat exchange sleeve is hermetically inserted and fixed in a second connecting pipe orifice, a heat exchange medium supply pipe is hermetically inserted in a heat exchange medium injection pipe orifice, a heat exchange medium outflow pipe is hermetically inserted in a heat exchange medium outflow pipe orifice, and the heat exchange medium supply pipe and the heat exchange medium outflow pipe are respectively connected with a temperature adjustment and heat exchange device for adjusting the temperature of the heat exchange medium. According to the temperature control device and method, the temperature of the developing solution can be adjusted more accurately.

Description

technical field [0001] The invention relates to a temperature control device for developing solution, and also relates to a temperature control method using the temperature control device. Background technique [0002] In the production process of semiconductor chips, developers and photoresists need to be used, and there are very strict requirements on the temperature of developers and photoresists, generally at 23 ± 0.1 degrees Celsius; The temperature control device is to install an electric heating device directly at the front end of the developer supply pipe, use the electric heating device to heat the developer in the developer supply pipe, and then use the cooling device outside the developer supply pipe to cool the developer , this structure leads to relatively low sensitivity of temperature control, and the temperature control may also be inaccurate, prone to deviation, especially when the flow rate of the developer fluctuates, the accuracy of temperature control is...

AI Technical Summary

Problems solved by technology

[0002] In the production process of semiconductor chips, developers and photoresists need to be used, and there are very strict requirements on the temperature of developers and photoresists, generally at 23 ± 0.1 degrees Celsius; The temperature control device is to install an electric heating device directly at the front end of the developer supply pipe, use the electric heating device to heat the developer in the developer supply pipe, and then use the cooling device outside the developer supply pipe to cool the developer , this structure leads to relatively low sensitivity of temperature control, and the temperature control may also be inaccurate, prone to deviation, especially when the flow rate of the developer fluctuates, the accuracy of temperature control is even lower

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