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A kind of aluminum induction electroless plating method of pre-plating copper film

A technology of electroless plating and pre-plating of copper, applied in the field of electroless plating, to achieve the effects of simple preparation method, easy operation, and expanded application range

Active Publication Date: 2021-09-03
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the copper base can only be used as the substrate when using aluminum-induced galvanic electroless plating in the traditional process, and to provide a method for aluminum-induced electroless plating of a pre-coated copper film

Method used

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  • A kind of aluminum induction electroless plating method of pre-plating copper film
  • A kind of aluminum induction electroless plating method of pre-plating copper film
  • A kind of aluminum induction electroless plating method of pre-plating copper film

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specific Embodiment approach 1

[0017] Specific embodiment one: the present embodiment a kind of aluminum induction chemical plating method of pre-plating copper film, completes according to the following steps:

[0018] Pretreat the base material to obtain product A, place product A in an electroless copper plating solution with a temperature of 50°C to 70°C and a pH of 4 to 5 to pre-plate a copper layer to obtain product B, and combine product B with aluminum foil , to obtain an aluminum-copper couple C, adding the aluminum-copper couple C to the metal salt complex solution, and reacting for 60 minutes to 90 minutes to obtain an electroless metal plating layer.

[0019] The beneficial effect of this implementation mode:

[0020] 1. In this embodiment, an aluminum-induced electroless plating method for a pre-coated copper film, in order to break through the limitation that the copper base can only be used as a substrate when using aluminum-induced galvanic electroless plating in the traditional process, by ...

specific Embodiment approach 2

[0022] Embodiment 2: This embodiment differs from Embodiment 1 in that: the material of the base material is 405nm photosensitive resin.

[0023] Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0024] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the base material is prepared by 3D printing.

[0025] Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention relates to an aluminum-induced chemical plating method for a pre-plated copper film, which relates to the technical field of chemical plating. The purpose of the invention is to solve the problem that the copper base can only be used as the substrate when aluminum-induced galvanic electroless plating is used in the traditional process. Method: 405nm photosensitive resin was prepared into a matrix material by 3D printing, with a size of Ф30*100mm. Pretreat the base material to obtain product A, place product A in an electroless copper plating solution with a temperature of 50°C to 70°C and a pH of 4 to 5 to pre-plate a copper layer to obtain product B, and combine product B with aluminum foil , to obtain an aluminum-copper couple C, adding the aluminum-copper couple C to the metal salt complex solution, and reacting for 60 minutes to 90 minutes to obtain an electroless metal plating layer. The invention can obtain an aluminum-induced electroless plating method of a pre-plated copper film.

Description

technical field [0001] The invention relates to the technical field of electroless plating, in particular to an aluminum-induced electroless plating method for a pre-plated copper film. Background technique [0002] Electroless plating is a metal deposition process carried out by a controlled chemical reduction method under the catalysis of the metal surface without external current. The metal deposition process is a pure chemical reaction, and the reaction must be carried out on the surface of a self-catalytic material. According to the principle of chemical reaction, the deposition of metal from the solution of metal salt is the reduction process of gaining electrons, conversely, the transformation of metal into metal ions in solution is the oxidation process of losing electrons. In the electroless plating reaction, the metal deposition process is a reduction reaction, which can obtain electrons from different ways, and then complete the metal deposition process. One is t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/28C23C18/30C23C18/40
CPCC23C18/285C23C18/30C23C18/40
Inventor 吴士平戴贵鑫陈瑞润黄西西王明杰郭荣阁
Owner HARBIN INST OF TECH