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Aluminum-induced chemical plating method of pre-plated copper film

A technology of electroless plating and pre-plating of copper, applied in the field of electroless plating, to achieve the effects of simple preparation method, expanded application range, and easy operation

Active Publication Date: 2021-01-22
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the copper base can only be used as the substrate when using aluminum-induced galvanic electroless plating in the traditional process, and to provide a method for aluminum-induced electroless plating of a pre-coated copper film

Method used

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  • Aluminum-induced chemical plating method of pre-plated copper film
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  • Aluminum-induced chemical plating method of pre-plated copper film

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specific Embodiment approach 1

[0017] Specific embodiment one: the present embodiment a kind of aluminum induction chemical plating method of pre-plating copper film, completes according to the following steps:

[0018] Pretreat the base material to obtain product A, place product A in an electroless copper plating solution with a temperature of 50°C to 70°C and a pH of 4 to 5 to pre-plate a copper layer to obtain product B, and combine product B with aluminum foil , to obtain an aluminum-copper couple C, adding the aluminum-copper couple C to the metal salt complex solution, and reacting for 60 minutes to 90 minutes to obtain an electroless metal plating layer.

[0019] The beneficial effect of this implementation mode:

[0020] 1. In this embodiment, an aluminum-induced electroless plating method for a pre-coated copper film, in order to break through the limitation that the copper base can only be used as a substrate when using aluminum-induced galvanic electroless plating in the traditional process, by ...

specific Embodiment approach 2

[0022] Embodiment 2: This embodiment differs from Embodiment 1 in that: the material of the base material is 405nm photosensitive resin.

[0023] Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0024] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the base material is prepared by 3D printing.

[0025] Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses an aluminum-induced chemical plating method for a pre-plated copper film, and relates to the technical field of chemical plating. The invention aims to solve the problem that only a copper base can be used as a base body when aluminum-induced galvanic couple chemical plating is used in the traditional process. The method comprises the following steps of preparing 405nm photosensitive resin into a base material by adopting three-dimensional (3D) printing, wherein the size of the base material is phi 30 * 100mm; pretreating the base material to obtain a product A; placingthe product A in a chemical copper plating solution with the temperature ranging from 50 DEG C to 70 DEG C and the pH ranging from 4 to 5 so as to be pre-plated with a copper layer to obtain a product B; combining the product B with an aluminum foil to obtain an aluminum-copper galvanic couple C; and adding the aluminum-copper galvanic couple C into a metal salt complex solution to react for 60 min to 90 min to obtain a chemical plating metal layer. According to the invention, the aluminum-induced chemical plating method of the pre-plated copper film can be obtained.

Description

technical field [0001] The invention relates to the technical field of electroless plating, in particular to an aluminum-induced electroless plating method for a pre-plated copper film. Background technique [0002] Electroless plating is a metal deposition process carried out by a controlled chemical reduction method under the catalysis of the metal surface without external current. The metal deposition process is a pure chemical reaction, and the reaction must be carried out on the surface of a self-catalytic material. According to the principle of chemical reaction, the deposition of metal from the solution of metal salt is the reduction process of gaining electrons, conversely, the transformation of metal into metal ions in solution is the oxidation process of losing electrons. In the electroless plating reaction, the metal deposition process is a reduction reaction, which can obtain electrons from different ways, and then complete the metal deposition process. One is t...

Claims

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Application Information

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IPC IPC(8): C23C18/28C23C18/30C23C18/40
CPCC23C18/285C23C18/30C23C18/40
Inventor 吴士平戴贵鑫陈瑞润黄西西王明杰郭荣阁
Owner HARBIN INST OF TECH