Liquid-solid phase continuous form prediction method for reflow soldering BGA group welding spot

A prediction method and reflow soldering technology, applied in the direction of prediction, data processing applications, instruments, etc., can solve the problems that the thermal deformation of PCB cannot be considered, and the real-time shape and deviation of BGA solder joints cannot be analyzed, so as to improve the accuracy of shape prediction and simulation The effect of high precision and simple simulation process

Pending Publication Date: 2021-01-22
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

This method requires a large amount of physical experimental data and has certain limitations. It can only analyze the final shape of solder joints, but cannot analyze the real-time shape of BGA solder joints with temperature changes.
None of the above four existing methods can obtain the shape change of the continuous liquid-solid phase in the physical process of solder joint melting and solidification, and it is difficult or impossi

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  • Liquid-solid phase continuous form prediction method for reflow soldering BGA group welding spot
  • Liquid-solid phase continuous form prediction method for reflow soldering BGA group welding spot
  • Liquid-solid phase continuous form prediction method for reflow soldering BGA group welding spot

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[0034] The following will clearly and completely describe the technical solutions in the present invention in combination with the accompanying drawings in the present invention. Obviously, the described embodiments are some embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] see Figure 1 to Figure 9 , the invention discloses a method for predicting the liquid-solid phase continuous shape of BGA group solder joints in reflow soldering, which can consider complex factors such as liquid-solid phase transition of solder joints, PCB thermal deformation, and temperature field changes of solder joints on the BGA group solder joints. Real-time shape influence, and the simulation process is relatively simple. Each will be described in detail below.

[0036] s...

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Abstract

The invention discloses a liquid-solid phase continuous form prediction method for a reflow soldering BGA group welding spot . Influence of coupling factors such as liquid-solid phase change of the welding spots, PCB thermal deformation and temperature field change of the welding spots on the forms of the BGA group welding spots is considered, so that the forms of the BGA group welding spots are accurately simulated and predicted, and the form prediction precision of the BGA group welding spots is improved. The reflow soldering BGA group solder joint liquid-solid phase continuous form prediction method is provided by taking the BGA group solder joint containing the PCB as an example, the method has the advantages of high simulation precision and simple simulation process, the simulation result is matched with empirical data, and the method has reasonability and effectiveness.

Description

technical field [0001] The invention relates to the technical field of electronic product manufacturing, in particular to a method for predicting the liquid-solid phase continuous shape of BGA solder joints in reflow soldering. Background technique [0002] The reliability of BGA packaged electronic products is closely related to the reliability of its solder joints. There are many factors that affect the reliability of solder joints, such as package size, material properties, geometry of solder joints, etc. Among these factors, the geometry of the solder joint plays a crucial role. Therefore, predicting the reflow shape of solder joints is of great significance for the high reliability analysis and control of BGA solder joints and the optimization of reflow soldering process. [0003] At present, there are mainly four methods for predicting the shape of BGA solder joints in reflow soldering: the first is to use Surface Evolver special software to simulate the spreading an...

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Application Information

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IPC IPC(8): G06F30/20G06F30/23G06Q10/04G06F119/14G06F113/08
CPCG06F30/20G06Q10/04G06F30/23G06F2119/14G06F2113/08Y02P90/30
Inventor 龚雨兵周红达郑显玲郑毅潘开林黄伟陈蔡
Owner GUILIN UNIV OF ELECTRONIC TECH
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