Film structure and film pasting method

A film structure and film sticking technology, applied in chemical instruments and methods, synthetic resin layered products, packaging, etc., can solve problems such as the difficulty of tearing off light release films and heavy release films

Inactive Publication Date: 2021-02-02
INTERFACE OPTOELECTRONICS (WUXI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Based on this, it is necessary to provide a film structure and a film sticking method for the difficult

Method used

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Embodiment Construction

[0032] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0033] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counte...

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Abstract

The invention relates to a film structure and a film pasting method. The film structure includes: a functional layer; an adhesion layer, which is arranged on the surface of the functional layer; a first release film, which comprises a first attaching part and a first extending part which are connected with each other, wherein the first attaching part is attached to the side, deviating from the functional layer, of the adhesion layer; a second release film, which comprises a second attaching part and a second extending part which are connected with each other, wherein the second attaching partis attached to the side, deviating from the adhesion layer, of the functional layer, and the second extending part is opposite to the first extending part; and an inner film, which is positioned between the first extension part and the second extension part, is attached to one of the first extending part and the second extending part, and is separated from the other one of the first extending partand the second extending part. According to the film structure, the first release film and the second release film can be torn off more easily and conveniently, and the efficiency of film pasting operation is improved.

Description

technical field [0001] The invention relates to the field of film sticking, in particular to a film structure and a film sticking method. Background technique [0002] Conductive cloth is usually attached to the surface of electronic devices such as smartphones and monitors, and the conductive cloth can function as electromagnetic shielding to protect electronic components inside the electronic device. The surface of traditional conductive cloth is usually covered with a layer of double-sided adhesive layer, so as to be attached to the surface of electronic equipment. And before the film sticking operation, the opposite surfaces of the double-sided adhesive layer and the conductive cloth are respectively attached with a light release film and a heavy release film to protect the conductive cloth and the double-sided adhesive layer from contamination. During the film pasting operation, the light release film is torn off first, so that the double-sided adhesive layer is attach...

Claims

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Application Information

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IPC IPC(8): B32B43/00B32B27/06B32B7/12B32B7/06B32B33/00B65B33/02B29C63/02
CPCB32B43/006B32B27/06B32B7/12B32B7/06B32B33/00B65B33/02B29C63/02
Inventor 班远峰彭伟李璟林黄彦衡
Owner INTERFACE OPTOELECTRONICS (WUXI) CO LTD
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