Multi-scene performance index prediction method and system for semiconductor production line

A forecasting method and production line technology, applied in forecasting, manufacturing computing systems, neural learning methods, etc., to achieve the effect of reducing demand, improving accuracy, and multi-data support

Active Publication Date: 2021-02-02
TONGJI UNIV
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are no literatures and patents related to the above-mentioned production line performance prediction method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-scene performance index prediction method and system for semiconductor production line
  • Multi-scene performance index prediction method and system for semiconductor production line
  • Multi-scene performance index prediction method and system for semiconductor production line

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment

[0066] Such as figure 1 As shown, the present invention provides a multi-scenario multi-performance index prediction method for semiconductor production lines, including a production scene quantitative division module, a main prediction network construction module, and a multi-scenario prediction model construction module. The production scene quantitative division module is driven by data, quantitatively maps the production line's WIP value, product average processing cycle, and utilization rate of each equipment, and divides the production line into three scenarios: light load, normal load, and heavy load; the main forecasting network construction module , taking the divided normal load data as sample data, combining the deep neural network algorithm with semiconductor production line performance prediction to construct a prediction network under normal load scenarios; multi-scenario prediction model building blocks: apply the idea of ​​transfer learning to production line pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a multi-scene performance index prediction method and system for a semiconductor production line, and the system comprises a production scene quantitative dividing module which is driven by data, carries out the quantitative mapping of a product value, a product average processing period and the utilization rate of all equipment of the production line, and divides the production line into a light-load scene, a normal-load scene and a heavy-load scene; a main prediction network construction module which is used for constructing a prediction network in a normal load scene by taking the divided normal load data as sample data and combining a deep neural network algorithm with semiconductor production line performance prediction; and a multi-scene prediction model construction module which is used for applying the idea of transfer learning to production line prediction and constructing networks under light-load and heavy-load scenes according to the constructed main prediction network so as to form a multi-scene prediction model. Compared with the prior art, the production line scenes are quantitatively divided, multiple production line performance indexes under different load scenes can be more accurately predicted, and online use can be achieved.

Description

technical field [0001] The present invention relates to the technical field of intelligent manufacturing, in particular to a multi-scenario performance index prediction method and system for semiconductor production lines. Background technique [0002] The manufacturing industry is the main body of the national economy, the engine of rapid economic growth, and an important manifestation of comprehensive national strength. In order to ensure competitiveness, manufacturing enterprises need to quickly carry out dynamic scheduling management and allocate resources reasonably. Real-time performance index prediction results can provide a basis for production decision-making and evaluation, so it is an inevitable requirement to quickly understand the performance index achieved by the production line under a certain scheduling mode. [0003] At present, there are mainly three methods of predictive model modeling: mathematical modeling, simulation modeling, and machine learning mode...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06Q10/04G06Q10/06G06Q50/04G06N3/04G06N3/08
CPCG06Q10/04G06Q10/06393G06Q50/04G06N3/08G06N3/045Y02P90/30
Inventor 乔非高陈媛刘鹃
Owner TONGJI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products