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Lamination layer deviation control method for multilayer FPC board

A control method and board stacking technology, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve problems such as layer deviation, large compression expansion and contraction deviation, etc., to achieve easy bending, quality and efficiency assurance, avoid The effect of product deformation layer deviation

Pending Publication Date: 2021-02-02
HUIZHOU KING BROTHER CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention uses the support plate and the FPC riveted together to support the thickness of the lamination before lamination, which solves the problem of large expansion and contraction deviation and layer deviation of the lamination of the multi-layer FPC board, and meets the quality requirements of the lamination of the multi-layer FPC board

Method used

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  • Lamination layer deviation control method for multilayer FPC board

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A method for controlling lamination bias of a multilayer FPC board, characterized in that it comprises the following steps:

[0032] S1. FPC layer production;

[0033] S2. Glue-coated PI layer production;

[0034] S3. Fabrication of supporting slabs;

[0035] S4. The production of the main card pressing laminated board: when pressing the laminated board, riveting the upper and lower sides of the support board and the stacked FPC layer together to carry out the pressing of the boards for hardness support;

[0036] S5. Remove the support plate after pressing: After pressing the multi-layer FPC board, drill the rivets at the riveting position of the board edge with a drill nozzle, remove the support plate, and take out the normal multi-layer FPC board. The post-process production can be carried out in the normal way.

[0037] In the present invention, the material characteristics of the FPC board are aimed at: light weight, thinner, easy to bend, extruded by high temper...

Embodiment 2

[0047] A method for controlling lamination bias of a multilayer FPC board, characterized in that it comprises the following steps:

[0048] S1. FPC layer production;

[0049] S2. Glue-coated PI layer production;

[0050] S3. Fabrication of supporting slabs;

[0051] S4. The production of the main card pressing laminated board: when pressing the laminated board, riveting the upper and lower sides of the support board and the stacked FPC layer together to carry out the pressing of the boards for hardness support;

[0052] S5. Remove the support plate after pressing: After pressing the multi-layer FPC board, drill the rivets at the riveting position of the board edge with a drill nozzle, remove the support plate, and take out the normal multi-layer FPC board. The post-process production can be carried out in the normal way.

[0053] In the present invention, the material characteristics of the FPC board are aimed at: light weight, thinner, easy to bend, extruded by high temper...

Embodiment 3

[0063] A method for controlling lamination bias of a multilayer FPC board, characterized in that it comprises the following steps:

[0064] S1. FPC layer production;

[0065] S2. Glue-coated PI layer production;

[0066] S3. Fabrication of supporting slabs;

[0067] S4. The production of the main card pressing laminated board: when pressing the laminated board, riveting the upper and lower sides of the support board and the stacked FPC layer together to carry out the pressing of the boards for hardness support;

[0068] S5. Remove the support plate after pressing: After pressing the multi-layer FPC board, drill the rivets at the riveting position of the board edge with a drill nozzle, remove the support plate, and take out the normal multi-layer FPC board. The post-process production can be carried out in the normal way.

[0069] In the present invention, the material characteristics of the FPC board are aimed at: light weight, thinner, easy to bend, extruded by high temper...

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Abstract

The invention belongs to the technical field of PCB processing, and provides a lamination layer deviation control method for a multilayer FPC board. The method comprises the following steps of S1, manufacturing an FPC layer, S2, manufacturing a gluing PI layer, S3, manufacturing a supporting board layer, S4, manufacturing a main clamping pressing laminated board: riveting the upper and lower boards of the support board and the laminated FPC layer together during pressing of the laminated board to carry out board arrangement pressing to carry out hardness support, and S5, disassembling the support board after lamination: drilling off rivets at the riveting positions of the edges of the laminated multilayer FPC board by using a drill bit in a drilling manner, taking off the support board, taking out the normal multilayer FPC board, and carrying out subsequent process manufacturing in a normal manner. The support board and the FPC are riveted together to support the lamination thickness before lamination, so that the problems of large lamination expansion and shrinkage deviation and layer deviation of the multilayer FPC are solved, and the quality requirement of lamination of the multilayer FPC is met.

Description

technical field [0001] The invention belongs to the technical field of PCB board processing, and in particular relates to a lamination deviation control method of a multilayer FPC board. Background technique [0002] With the rapid development of electronic technology, the market demand for FPC printed circuit boards is increasing day by day. Its advantages can greatly reduce the volume and weight of electronic products, and it is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDA, digital cameras and other fields or products. In addition, it can also be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and stretched arbitrarily in the three-dimensional space, so as to achieve the integrated effect of component assembly and wire connect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638
Inventor 张伟伟李波陈春石学兵樊廷慧唐宏华黄双双
Owner HUIZHOU KING BROTHER CIRCUIT TECH
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