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Method for Dimensional Stabilization of Circuit Boards with Cores of Different Thicknesses

A dimensionally stable, circuit board technology, applied in printed circuit, multi-layer circuit manufacturing, printed circuit manufacturing, etc., to achieve the effect of improving production yield, improving production capacity, and solving layer deviation problems

Active Publication Date: 2018-01-12
SHENZHEN XUNJIEXING TECH CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The invention provides a method for stabilizing the size of the printed circuit board with different thickness core boards, which can effectively control the size of the multi-layer special structure printed circuit board and effectively solve the problem of layer deviation caused by the difference in size between the inner layers.

Method used

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  • Method for Dimensional Stabilization of Circuit Boards with Cores of Different Thicknesses
  • Method for Dimensional Stabilization of Circuit Boards with Cores of Different Thicknesses
  • Method for Dimensional Stabilization of Circuit Boards with Cores of Different Thicknesses

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Embodiment Construction

[0020] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.

[0021] figure 1 with figure 2 The difference in dimensional change of the two structures in the production will be completely different. Since the thickness of the core plate of the normal structure is the same, it is only necessary to consider the impact of the remaining copper on the core plate to correct the size. For special structures, it is necessary to consider not only the effect of plate thickness on dimensional changes, but also the stress of other layers and the force difference of the thick core plate. However, there is no solution for special structures in the prior art.

[0022] Please refer to image 3 , the invention provides a method for stabilizing the dimensions of circuit boards with core boards of different thicknesses, comp...

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Abstract

The invention provides a method for stabilizing the size of a circuit board with core boards of different thicknesses, comprising the following steps: step 1, establishing correspondence tables of thick core board thickness, thin core board thickness, thick core board compensation coefficient and thin core board compensation coefficient under different hot melting temperatures according to the hot melting temperature needed for bonding sheets in the circuit board press-fitting process; step 2, selecting the corresponding correspondence table according to the actual hot melting temperature of a bonding sheet; step 3, determining the thick core board compensation coefficient and the thin core board compensation coefficient according to the thick core board thickness and the thin core board thickness in the correspondence table; and step 4, calculating the thick core board size and the thin core board size after compensation according to the predetermined sizes of thick and thin core boards and the thick core board compensation coefficient and the thin core board compensation coefficient. By adopting the method of the invention, the size of a multilayer special-structure printed circuit board can be controlled effectively, and the problem of layer offset caused by size difference between inner layers is solved effectively.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for stabilizing the dimensions of circuit boards with core boards of different thicknesses. Background technique [0002] With the development of printed circuit boards to multi-layer, high-precision, and light and thin, dimensional stability has become an abnormality that goes hand in hand, constantly challenging the stability of products, and disturbing the quality control of high-end products. When dimensional stability appears as an abnormality , the destructive force it causes is scrapping. Except some can be saved at high cost. No possibility of rework. [0003] There are two types of multilayer printed circuit board structures: figure 1 The normal structure shown with figure 2 In the special structure shown, the difference between the two structures is that the thickness of the core plate of the normal structure is the same, and the thickness of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/46H05K2203/0278
Inventor 马卓胡贤金陈强王一雄
Owner SHENZHEN XUNJIEXING TECH CORP LTD
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