6N rotating target material and preparation method thereof

A technology of rotating target and mixing solution, applied in metal material coating process, vacuum evaporation coating, coating and other directions, can solve the problems of large grain gap, mechanical stress impurities, high production cost, and achieve uniform grain size, The effect of less mechanical stress and low production cost

Pending Publication Date: 2021-02-05
四川华芯腾科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a 6N rotating target and a preparation method thereof. The preparation method is simple and easy to operate, and can produce a 6N rotating target with less impurity content, which effectively solves the problems of the prior art. Problems such as mechanical stress and impurities, large grain gap and high production cost are easy to occur in the process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022]A 6N rotating target, the preparation method includes the following steps:

[0023](1) After polishing the surface of 6N copper raw material, pickling with mixed solution for 10 minutes, then rinse with water and alcohol, and drying to obtain pretreated copper raw material; the mixed solution is nitric acid solution and hydrofluoric acid solution in a volume ratio of 1:1 ; The concentration of nitric acid solution is 0.6vt%, and the concentration of hydrofluoric acid is 3vt%;

[0024](2) Preheat the pretreated copper raw material obtained in step (1) by electromagnetic induction heating at 400℃ for 1h, and then at 1100℃, the vacuum degree is 3×10-2Smelt under Pa vacuum conditions. After the melting is complete, the temperature is increased to 20℃ and the temperature is overheated for 10 minutes, poured and cooled to obtain a copper rod (130mm);

[0025](3) The copper rod obtained in step (2) is fixed in a hollow tubular mold (with an inner diameter of 167mm), and the hole is expanded b...

Embodiment 2

[0027]A 6N rotating target, the preparation method includes the following steps:

[0028](1) After polishing the surface of the 6N copper raw material, pickling it with a mixed solution for 13 minutes, then washing with water and alcohol, and drying to obtain the pretreated copper raw material; the mixed solution is a nitric acid solution and a hydrofluoric acid solution in a volume ratio of 1:2 ; The concentration of nitric acid solution is 0.7vt%, and the concentration of hydrofluoric acid is 3.5vt%;

[0029](2) Preheat the pre-treated copper raw material obtained in step (1) by electromagnetic induction heating at 450℃ for 2h, and then at 1150℃, the vacuum degree is 4×10-2Smelt under Pa vacuum conditions. After the melting is complete, the temperature is raised to 40℃ and the temperature is overheated for 15 minutes, poured and cooled to obtain a copper rod (130mm);

[0030](3) The copper rod obtained in step (2) is fixed in a hollow tubular mold (with an inner diameter of 167mm), and a w...

Embodiment 3

[0032]A 6N rotating target, the preparation method includes the following steps:

[0033](1) After polishing the surface of 6N copper raw material, pickling with mixed solution for 15min, then washing with water and alcohol, and drying to obtain pretreated copper raw material; the mixed solution is nitric acid solution and hydrofluoric acid solution in a volume ratio of 1:1 ; The concentration of nitric acid solution is 0.8vt%, and the concentration of hydrofluoric acid is 4vt%;

[0034](2) Preheat the pre-treated copper raw material obtained in step (1) by electromagnetic induction heating at a temperature of 500℃ for 2h, and then at a temperature of 1150℃ and a vacuum of 4×10-2Smelt under Pa vacuum conditions. After the melting is complete, the temperature is increased to 60℃ and the temperature is overheated for 15 minutes, poured and cooled to obtain a copper rod (130mm);

[0035](3) The copper rod obtained in step (2) is fixed in a hollow tubular mold (with an inner diameter of 167mm), ...

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PUM

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Abstract

The invention discloses a 6N rotary target material and a preparation method thereof. The preparation method comprises the following steps that the surface of a 6N copper raw material is polished andthen subjected to acid pickling for 10-20 min through a mixed solution, then the 6N copper raw material is washed with clear water and ethyl alcohol in sequence and dried, and a pretreated copper rawmaterial is obtained; the pretreated copper raw material is preheated for 1-3h at the temperature of 400-600 DEG C, smelted at the temperature of 1100-1200 DEG C, heated to 20-100 DEG C after completemelting to be subjected to overheating heat preservation for 10-20min, and then subjected to pouring and cooling to obtain a copper rod; and the copper rod is fixed by a die to be subjected to chambering for 4-6 times through a drilling machine, and the 6N rotating target material is obtained. The invention further discloses the 6N rotating target material prepared by the method. The preparationmethod is simple and easy to operate, the 6N rotating target material with low impurity content can be prepared, and the problems that in the prior art, mechanical stress and impurities are prone to being generated, grain gaps are large, and the production cost is high are effectively solved.

Description

Technical field[0001]The invention relates to the technical field of rotating target material preparation, in particular to a 6N rotating target material and a preparation method thereof.Background technique[0002]Sputtering technology is one of the main technologies for preparing thin-film materials, while the target material is the key consumable material required for sputtering coating. It is a functional material with high added value, and is mainly used in integrated circuits, information storage, liquid crystal displays, lasers Storage, electronic control devices, etc., are also widely used in the field of glass coating, wear-resistant materials, high-temperature corrosion-resistant, high-end decorative products and other industries. Various thin-film materials used in cutting-edge technology are manufactured. Not only are they used in large quantities, but the quality of the target The properties of metal thin film materials (thickness, uniformity, and low resistivity of the f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/14C23G1/10C22C1/02B23P15/00
CPCC23C14/3414C23C14/14C23G1/103C22C1/02B23P15/00
Inventor 郑巧郑好郑好巧妙
Owner 四川华芯腾科技有限责任公司
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