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Radio frequency power amplifier module

A technology of radio frequency power amplifier and power amplifier, applied in the field of communication, can solve the problem of low material reusability, and achieve the effect of relieving storage pressure, reducing cost, and solving low material reusability

Pending Publication Date: 2021-02-05
ZHEJIANG SUNWAVE LEAPWAVE NETWORK CO LTD +1
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  • Abstract
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  • Claims
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Problems solved by technology

[0005] The embodiment of the present application provides a radio frequency power amplifier module to at least solve the problem of low material reusability of radio frequency power amplifier products in the related art

Method used

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Embodiment Construction

[0027] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application. In addition, it can also be understood that although such development efforts may be complex and lengthy, for those of ordinary skill in the art relevant to the content disclosed in this application, the technology disclosed in this application Some design, manufacturing or production changes based on the content are just conventional technical means, and...

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Abstract

The invention relates to a radio frequency power amplifier module, which is characterized in that functional units of the radio frequency power amplifier module are respectively arranged on a first circuit board and a second circuit board; wherein the first circuit board comprises a first physical connection structure and a first electrical interface, and the second circuit board comprises a second physical connection structure and a second electrical interface; the functional unit of the radio frequency power amplifier module comprises a final-stage power amplifier, and the final-stage poweramplifier is arranged on the first circuit board; the first physical connection structure and the second physical connection structure are used for fixing the first circuit board and the second circuit board; and the first electrical interface and the second electrical interface are used for providing electrical connection between the first circuit board and the second circuit board, so that the problems of low material reusability and high cost of radio frequency power amplifier products are solved, the development period is shortened, and the supply chain storage pressure is relieved.

Description

technical field [0001] The present application relates to the technical field of communication, in particular to a radio frequency power amplifier module. Background technique [0002] With the rapid development of cellular mobile communication technology, the demand for different standards of GSM, CDMA, WCDMA, TD-SCDMA, LTE and NR, different frequency bands 800MHz~3800MHz, and different power levels in the segmented market is increasingly diverse. This brings new challenges to the iterative update of mobile communication product development. In the front-stage circuit of the communication product transmitter, the RF signal power generated by the modulation oscillator circuit is very small, and it needs to go through a series of amplification-buffer stage, intermediate amplification stage, and final power amplification stage to obtain sufficient RF power. It can be fed to the antenna and radiated out. In order to obtain a large enough radio frequency output power, a radio ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03F3/24H03F1/00
CPCH03F3/24H03F1/00
Inventor 李华鸿龚丽萍李玉兵
Owner ZHEJIANG SUNWAVE LEAPWAVE NETWORK CO LTD
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