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Paster type ultraviolet sensor

An ultraviolet sensor and chip technology, applied in the field of sensors, can solve the problems of poor heat dissipation performance, complex process, general optical power, etc., and achieve the effects of stable performance, good heat dissipation performance and simple production process

Pending Publication Date: 2021-02-09
安徽省紫芯半导体技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The ultraviolet sensor is a sensor that uses a photosensitive element to convert ultraviolet signals into electrical signals. Its structure generally includes a housing and a built-in ultraviolet chip, and the pins connected to the ultraviolet are drawn outside the housing. The process itself is relatively complicated, and, The overall no heat dissipation design, the heat dissipation performance is poor, and the optical power is relatively average

Method used

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  • Paster type ultraviolet sensor
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Embodiment Construction

[0019] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0020] Example: such as figure 1 and 2 As shown, the patch-type ultraviolet sensor of this embodiment is the transmitting end of the sensor, including a base body 1, an esd electrostatic protection Zener tube 2, an ultraviolet chip 3, a positive electrode pad 4 and a negative electrode pad 5, and one end of the above-mentioned base body 1 An installation cavity is provided, and the bottom of the above-mentioned installation cavity is pasted and fixed with a piece of the above-mentioned positive electrode pad 4 and a piece of negative electrode pad 5 distributed at intervals. The above-mentioned esd electrostatic protection Zener tube 2 and the ultraviolet chip 3 are arranged in the above-mentioned installation cavit...

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Abstract

The invention relates to the technical field of sensors, in particular to a patch type ultraviolet sensor. The patch type ultraviolet sensor comprises a seat body, an esd electrostatic protection Zener tube, an ultraviolet chip, a positive electrode bonding pad and a negative electrode bonding pad, a mounting cavity is formed in one end of the seat body, and the positive electrode bonding pad andthe negative electrode bonding pad which are distributed at intervals are attached and fixed to the bottom of the mounting cavity; an esd electrostatic protection Zener tube and the ultraviolet chip are arranged in the mounting cavity, the positive electrodes and the negative electrodes of the esd electrostatic protection Zener tube and the ultraviolet chip are correspondingly welded to a positiveelectrode bonding pad and a negative electrode bonding pad which are located in the mounting cavity respectively, and the other end of the seat body is fixedly provided with the positive electrode bonding pad and the negative electrode bonding pad which are distributed at intervals in an attached mode. The positive electrode bonding pads and the negative electrode bonding pads at the two ends ofthe base body correspond to each other, the two positive electrode bonding pads and the two negative electrode bonding pads are correspondingly connected and conducted respectively, and a lens is installed on the open side of the mounting cavity. The patch type ultraviolet sensor has the advantages of simple production process, good heat dissipation performance and relatively stable overall performance.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a patch type ultraviolet sensor. Background technique [0002] The ultraviolet sensor is a sensor that uses a photosensitive element to convert ultraviolet signals into electrical signals. Its structure generally includes a housing and a built-in ultraviolet chip, and the pins connected to the ultraviolet are drawn outside the housing. The process itself is relatively complicated, and, There is no heat dissipation design overall, the heat dissipation performance is poor, and the optical power is relatively average. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a patch type ultraviolet sensor, which effectively overcomes the defects of the prior art. [0004] The technical scheme that the present invention solves the problems of the technologies described above is as follows: [0005] A patch type ultraviolet senso...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0203H01L31/024H01L31/02H01L25/16
CPCH01L25/167H01L31/02002H01L31/0203H01L31/024
Inventor 刘英瞿鸯
Owner 安徽省紫芯半导体技术有限公司