Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat exchanger for printed circuit board

A technology for printed circuit boards and heat exchangers, applied in the direction of heat exchanger types, heat exchanger shells, indirect heat exchangers, etc. Small inlet resistance, improving the effect of uneven fluid flow

Active Publication Date: 2021-02-12
WUHAN SECOND SHIP DESIGN & RES INST
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a printed circuit board heat exchanger, which is used to solve the problem that in the existing printed circuit board heat exchanger, the flow rate of the fluid from the inlet channel into each layer of the fluid channel is inconsistent, which affects its heat transfer performance.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat exchanger for printed circuit board
  • Heat exchanger for printed circuit board
  • Heat exchanger for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] In the description of the embodiments of the present invention, it should be noted that unless otherwise specified and limited. The directions of "left" and "right" are all subject to the directions shown in the attached drawings. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention relates to the technical field of heat exchangers and provides a heat exchanger for a printed circuit board. The heat exchanger for the printed circuit board comprisesa spiral structural part and multiple layers of heat exchange plate sheets arranged in a stacked manner. The heat exchange plate sheets are provided with through holes, the through holes of the heat exchange plate sheets communicate to form an inlet channel, an inlet of a fluid channel between the heat exchange plate sheets communicates with the inlet channel, and the spiral structural part is arranged in the inlet channel. By arranging the spiral structural part in the inlet channel, vertical flow of the fluid in the inlet channel is converted into spiral flow, so that the included angle between the flowing speed direction of the fluid and the heat exchange plate sheet is reduced and a centrifugal force is generated. Under the action of the centrifugal force, the fluid enters the fluid channels of all layers, so that the inlet resistance of the fluid entering the fluid channel is reduced, the problem that the fluid flow of the fluid channel of each layer is not uniform is solved and the heat exchange performance of the heat exchanger for the printed circuit board is improved.

Description

technical field [0001] The invention relates to the technical field of heat exchangers, in particular to a printed circuit board heat exchanger. Background technique [0002] The printed circuit board heat exchanger is made by stacking and welding the heat exchange plates engraved with fine channels by diffusion welding technology. It has the characteristics of compact structure and strong pressure bearing capacity. Broad application prospects. [0003] Each heat exchange plate of the printed circuit board heat exchanger is provided with two through holes at the corresponding positions. After stacking multiple heat exchange plates, two inlet channels of the plate heat exchanger are formed. After the hot fluid and the cold fluid are passed into different inlet channels respectively, they enter the fluid channels between the heat exchange plates of each layer from the inlet channels. However, since the velocity direction of the fluid at the inlet end of the inlet channel is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): F28D9/00F28F3/08F28F9/10F28F9/24
CPCF28D9/00F28F3/08F28F9/10F28F9/24
Inventor 陈凯柯汉兵林原胜柯志武黄崇海肖颀魏志国庞杰李邦明李勇吴君刘伟张克龙王俊荣赵振兴苟金澜戴春辉代路
Owner WUHAN SECOND SHIP DESIGN & RES INST