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A smt placement machine adsorption device

A technology of adsorption device and placement machine, applied in the direction of electrical components, electrical components, etc., can solve the problems of increased defect rate, poor quality of placement, and falling, and achieve the effect that it is not easy to fall

Active Publication Date: 2021-10-22
赣州深奥电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the device for patch adsorption generally uses a suction cup, but the structure of the suction cup is difficult to meet the above requirements, and it is very easy to fall off during the patch process.
Moreover, the bottom of the patch is easy to absorb dust during the handling process, resulting in poor patch quality and increased defect rate

Method used

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  • A smt placement machine adsorption device
  • A smt placement machine adsorption device
  • A smt placement machine adsorption device

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Embodiment Construction

[0019] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0020] Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0021] In describing the present invention, it is to be understood that the terms "one end", "the other end", "outer side", "upper", "inner side", "horizontal", "coaxial", "central", "end ", "length", "outer end" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the d...

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PUM

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Abstract

The invention discloses an adsorption device for an SMT placement machine, which includes a main body of the SMT placement machine and an adsorption device installed on the main body of the SMT placement machine. The adsorption device is driven down and displaced by a driving mechanism on the main body of the SMT placement machine , it is characterized in that: the adsorption device includes a device board, the device board is connected to an air blowing box through a fixed rod, the device board is installed on the driving mechanism, a bottom plate is installed on the bottom of the air blowing box, and the bottom of the bottom plate is provided with more than one There is an air intake cavity in the blowing box, the bottom of the air intake cavity is open, and the bottom open end is sealed by the bottom plate. The placement machine of the present invention can absorb patches of various sizes and types, has a very good adsorption effect, and can remove dust at the bottom of the patch.

Description

technical field [0001] The invention relates to the field of SMT placement, in particular to an adsorption device for an SMT placement machine. Background technique [0002] Currently in the field of electronic product manufacturing, due to the advantages of high efficiency, high yield and low cost of SMT (Surface Mount Technology) patch technology, this technology is widely used in the manufacturing process of electronic products. However, due to There are many types of electronic devices and they come in a variety of form factors. At present, the suction cup is generally used in the patch adsorption device, but the structure of the suction cup is difficult to meet the above requirements, and it is very easy to drop during the patching process. Moreover, the bottom of the patch is easy to absorb dust during the handling process, resulting in poor patch quality and increased defect rate. Contents of the invention [0003] The technical problem to be solved by the present...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH05K13/0409
Inventor 韩里平
Owner 赣州深奥电子有限公司