High-speed interconnection assembly for 5G communication

A high-speed interconnection and component technology, which is applied to the parts of the connecting device, the device of connecting/disconnecting the connecting parts, and the connection, etc., can solve the problems of equipment performance impact, user loss, theft of high-speed interconnection components, etc., and achieve mobile Smooth and controllable, increasing stability and reducing loss

Inactive Publication Date: 2021-02-19
嘉兴新博信息科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a high-speed interconnection component for 5G communication to solve the problem that t

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  • High-speed interconnection assembly for 5G communication
  • High-speed interconnection assembly for 5G communication
  • High-speed interconnection assembly for 5G communication

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Embodiment Construction

[0032] The present invention will be described in detail below in conjunction with various embodiments shown in the drawings. However, these embodiments do not limit the present invention, and structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0033] The invention discloses a high-speed interconnection component for 5G communication. Figure 1-Figure 6 As shown, a first interconnection joint 1 is included, a second interconnection joint 101 is connected to one side of the first interconnection joint 1, a pair of locking mechanisms 2 are connected between the first interconnection joint 1 and the second interconnection joint 101, and the locking mechanism 2 includes an electromagnet 201, the electromagnet 201 is connected with the first interconnection joint 1, the side of the electromagnet 201 close to the second interconnection joint 101 is connected with a ...

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Abstract

The invention discloses a high-speed interconnection assembly for 5G communication, and the assembly comprises a first interconnection joint, one side of the first interconnection joint is connected with a second interconnection joint, a pair of locking mechanisms are connected between the first interconnection joint and the second interconnection joint, each locking mechanism comprises an electromagnet, and each electromagnet is connected with the corresponding first interconnection joint. A locking pipeline is connected to the side, close to the second interconnection joint, of each electromagnet, a magnetic suction pipe is arranged in each locking pipeline, an insertion rod is arranged in each magnetic suction pipe, and a limiting connecting block is connected to the second interconnection joint. Through the arrangement of the corresponding mechanisms on the high-speed interconnection assembly, the possibility that the high-speed interconnection assembly is stolen is greatly reduced, the safety of the high-speed interconnection assembly is greatly improved, meanwhile, the influence on 5G base station transmission is reduced, accumulation of a large amount of data is avoided, theinfluence on equipment performance is reduced, and damage to equipment is avoided. Therefore, the loss of a user is reduced.

Description

technical field [0001] The invention belongs to the technical field of 5G communication, and in particular relates to a high-speed interconnection component for 5G communication. Background technique [0002] 5G base stations are the core equipment of 5G networks, providing wireless coverage and realizing wireless signal transmission between wired communication networks and wireless terminals. The architecture and form of base stations directly affect how 5G networks are deployed. In technical standards, the frequency band of 5G is much higher than 2G, 3G and 4G networks, 5G networks mainly work in the 3000-5000MHz frequency band at this stage, because the higher the frequency, the greater the attenuation in the signal propagation process, so the base station density of the 5G network will be higher. Communication between devices generally uses high-speed interconnection components, which greatly improves the speed of device communication between devices in the 5G base stati...

Claims

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Application Information

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IPC IPC(8): H01R13/62H01R13/639H01R13/66H01R24/00
CPCH01R13/6205H01R13/639H01R13/66H01R13/665H01R13/6675H01R13/6691H01R24/005
Inventor 牛俊华
Owner 嘉兴新博信息科技有限公司
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