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Multi-scale branch liquid leakage monitoring device for chip-level liquid cooling heat dissipation system

A technology of liquid cooling and monitoring devices, which is applied in the direction of using liquid/vacuum to measure liquid tightness and detecting the appearance of fluid at the leakage point, so as to achieve the effect of expanding the scope of application and reducing the volume

Pending Publication Date: 2021-03-02
CHINA ACAD OF AEROSPACE AERODYNAMICS
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  • Description
  • Claims
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Problems solved by technology

[0006] The technical problem of the present invention is to overcome the deficiencies of existing products and technologies, provide a multi-scale branch liquid leakage monitoring method and device for chip-level liquid cooling and heat dissipation systems, and fill the gap in the monitoring field of chip-level computer room heat dissipation systems. Improve system safety and reduce potential safety hazards of liquid leakage

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  • Multi-scale branch liquid leakage monitoring device for chip-level liquid cooling heat dissipation system
  • Multi-scale branch liquid leakage monitoring device for chip-level liquid cooling heat dissipation system

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Embodiment Construction

[0029] Preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0030] In order to facilitate the understanding of the solutions and effects of the embodiments of the present invention, a specific application example is given below. Those skilled in the art will understand that this example is only for the purpose of facilitating the understanding of the present invention, and any specific details thereof are not intended to limit the present invention in any way.

[0031] In order to make the purpose, ...

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Abstract

The invention provides a multi-scale branch liquid leakage monitoring device for a chip-level liquid cooling heat dissipation system. The liquid cooling heat dissipation system is provided with a circulation loop device which comprises a liquid supply main pipe, a liquid return main pipe, a first branch liquid supply pipe, a first branch liquid return pipe, a second branch liquid supply pipe, a second branch liquid return pipe, a heat pipe unit, and a quick plug connector. The multi-scale branch liquid leakage monitoring device comprises a liquid leakage monitor, a liquid leakage detection core wire set and a liquid leakage detection core wire tail end, the liquid leakage monitor is the starting end of the liquid leakage detection core wire set, and the liquid leakage detection core wire set is circularly wound on a circulation loop device of the liquid cooling heat dissipation system upwards from the lowermost end of the liquid supply main pipe in an attached mode. Each cycle passes through the first branch liquid supply pipe, the liquid return main pipe, the first branch liquid return pipe and the liquid supply main pipe in sequence and finally reaches the liquid leakage detection core wire tail end. According to the invention, the positioning monitoring function of the liquid cooling heat dissipation loop device can be realized, and flexible arrangement can be carried out for various complex structures such as multi-scale branches and the like.

Description

technical field [0001] The invention belongs to the field of computer room heat dissipation technology and the field of computer room monitoring, and is especially suitable for a chip-level liquid-cooled heat dissipation circuit device including a multi-scale branch structure. Background technique [0002] The problem of heat dissipation and energy consumption in the computer room becomes more and more significant with the increase of cabinet density and computing scale. Existing heat dissipation methods are mainly realized by air conditioners and liquid-cooled backplanes, both of which belong to the computer room-level or cabinet-level heat dissipation mode. In order to further solve the heat dissipation problem of local hot spots of server chips, it is necessary to develop a new computer room heat dissipation technology based on chip-level heat dissipation mode. The prior art proposes a liquid-cooling heat dissipation circulation circuit device for blade servers, which in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01M3/16
CPCG01M3/16
Inventor 聂榕序薛志虎谢铭慧李炜刘晁曲伟罗晓光
Owner CHINA ACAD OF AEROSPACE AERODYNAMICS
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