Low-temperature sintered zirconia ceramic substrate

A zirconia ceramic, low-temperature sintering technology, applied in ohmic resistance heating, application, tobacco and other directions, to achieve the effects of stable use performance, reduced use cost and long service life
CN112469149AInactive Publication Date: 2021-03-09嘉兴屹飞材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
嘉兴屹飞材料科技有限公司
Publication Date
2021-03-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a low-temperature sintered zirconia ceramic substrate, and relates to the field of ceramic substrates. The low-temperature sintered zirconia ceramic substrate comprises a zirconia ceramic substrate body, a first insulating layer is fixedly connected to the bottom of the zirconia ceramic substrate body, a first metal protective sleeve is fixedly connected to one side of the upper surface of the zirconia ceramic substrate body, and a first welding disc is arranged in the first metal protective sleeve; the zirconia ceramic substrate body is fixedly connected to the bottom of the first welding disc, a first circular fixing plate is fixedly connected to the upper surface of the first welding disc, and a first lead is fixedly connected to one side of the first circular fixing plate. And a second metal protective sleeve is fixedly connected to the upper surface of the zirconia ceramic substrate body and is symmetrical to the first metal protective sleeve, and a second welding disc is arranged in the second metal protective sleeve. And by using a copper oxide connecting layer, the bending strength and the wear resistance of the zirconium oxide ceramic substrate are enhanced.
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Description

technical field

[0001] The invention relates to the technical field of ceramic substrates, in particular to a low-temperature sintered zirconia ceramic substrate. Background technique

[0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of a ceramic substrate (single or double-sided) at high temperature. The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, which has a large load-bearing capacity. flow capability. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. It has the advantages of high resistance, outstanding high-frequency characteristics, high thermal conductivity, good chemical stability, shock resistance, heat resistance, pressure res...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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