Microphone chip, mems microphone and electronic device
An electronic device and microphone technology, applied in the field of microphones, can solve problems such as restricting the yield and reliability of MEMS microphones, back electrode adhesion, scrapping, etc., and achieve the effect of reducing functional failure or scrapping and improving yield and reliability
Active Publication Date: 2022-03-25
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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Problems solved by technology
However, the distance between the diaphragm and the back pole is small, and when the wet etching process is performed in the process of manufacturing the microphone chip, or during the working process of the microphone chip, the diaphragm is prone to relatively large vibrations and touches the back pole , and then stick or adsorb together with the back electrode, which will easily lead to the failure or scrapping of the microphone chip function, which seriously restricts the yield and reliability of the MEMS microphone
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0026] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.
[0027] In addition, if there are descriptions involving "first", "second" and ...
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The invention discloses a microphone chip, a MEMS microphone and an electronic device. The microphone chip includes a substrate, a vibrating membrane, a back pole and a column; wherein, the substrate is provided with a back cavity that runs through in an up-down direction; the vibrating membrane arranged on the upper end of the substrate, the diaphragm includes a connection part connected to the substrate, and an induction part connected to the connection part and covering the back cavity; the back electrode is arranged on the On the vibrating membrane, a vibrating cavity communicating with the back cavity is formed at an interval between the back pole and the sensing part of the vibrating membrane; the upright column is configured on the upper surface of the sensing part of the vibrating membrane. The microphone chip of the present invention can reduce the occurrence of adhesion / adsorption of the diaphragm and the back electrode of the microphone chip.
Description
technical field [0001] The invention relates to the technical field of microphones, in particular to a microphone chip. Background technique [0002] A Micro Electro Mechanical System (MEMS microphone for short) is usually applied to an electronic device as an acoustic-electric conversion device. A microphone chip is arranged in the shell of the MEMS microphone, and a certain distance is formed between the diaphragm and the back electrode of the microphone chip to form a flat capacitor. However, the distance between the diaphragm and the back pole is small, and when the wet etching process is performed in the process of manufacturing the microphone chip, or during the working process of the microphone chip, the diaphragm is prone to relatively large vibrations and touches the back pole , and then stick or adsorb together with the back electrode, which will easily lead to functional failure or scrapping of the microphone chip, which seriously restricts the yield and reliabil...
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IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04H04R31/00H04R31/003H04R31/006H04R2201/003H04R2231/00H04R2231/003
Inventor 田伟王景雪夏贝贝官勐杰
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD