A packaging method for chip reliability vacuum packaging welding equipment

Abstract

The invention discloses a packaging method for chip reliability vacuum packaging and welding equipment. The vacuum packaging and welding equipment includes a vacuum chamber, a tube shell fixture assembly, a germanium window fixture assembly and a shielding assembly arranged in the vacuum chamber. A shell is provided on the shell fixture assembly, and there is solder on the shell, and a germanium window is provided on the germanium window fixture assembly, and there is a getter on the germanium window; the welding method includes the following steps: step S1, vacuum packaging welding The equipment vacuumizes the vacuum cavity and performs a dehumidification process; step S2, the vacuum packaging welding equipment performs the process of activating the getter; step S3, the vacuum packaging welding equipment performs the process of welding the tube shell and the germanium window. This application adds a getter thermal activation process. The getter can effectively absorb certain gas molecules to obtain or maintain a vacuum and purify the gas environment. When the germanium window and the tube shell are welded, the getter is activated to purify the confined space. , Improve the stability and reliability of welding products.

Description

technical field [0001] The invention relates to the technical field of chip welding, in particular to a packaging method for chip reliability vacuum packaging welding equipment. Background technique [0002] The packaging of vacuum packaging and welding equipment is greatly affected by the environment of vacuum and purified gas. The existing vacuum welding equipment is to extract the gas in the welding environment before welding, but it is impossible to extract the welding environment into a pure Vacuum, which also contains a certain amount of air, cannot guarantee the vacuum of the welding environment and the environment of purified gas, and cannot guarantee the stability and reliability of the finished product. Contents of the invention [0003] The invention provides a packaging method used for chip reliability sealing and chip reliability vacuum packaging welding equipment, which improves the stability and reliability of welding finished products. [0004] In order to...

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Problems solved by technology

[0002] The packaging of vacuum packaging and welding equipment is greatly affected by the environment of vacuum and purified gas. The existing vacuum welding equipment is to extract the gas in the welding environment before welding, but it is impossible to extract the welding environment into a pure Vacuum, which also contains a certain amount of air, cannot guarantee the vacuum of the welding environment and the environment of purified gas, and cannot guarantee the stability and reliability of the finished product

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