Packaging method for chip reliability vacuum packaging and welding equipment

Abstract

The invention discloses a packaging method for chip reliability vacuum packaging and welding equipment. The chip reliability vacuum packaging and welding equipment comprises a vacuum cavity, a tube shell jig component, a germanium window jig component and a shielding component, wherein the tube shell jig component, the germanium window jig component and the shielding component are arranged in thevacuum cavity; a tube shell is arranged on the tube shell jig component; solder is arranged on the tube shell; and a germanium window is arranged on the germanium window jig component; and a getter isarranged on the germanium window. A welding method of the chip reliability vacuum packaging and welding equipment comprises the following steps that S1, vacuum packaging welding equipment conducts vacuumizing treatment on the vacuum cavity, and the dehumidification process is executed; S2, the vacuum packaging welding equipment executes the process of activating the getter; and S3, vacuum packaging and welding equipment executes the process of welding the tube shell and the germanium window. According to the packaging method for the chip reliability vacuum packaging and welding equipment, Thegetter thermal activation process is additionally provided, the getter can effectively absorb some gas molecules to obtain or maintain vacuum and purify the gas environment, the closed space is purified by the activated getter when the germanium window and the tube shell are welded, and the stability and reliability of a welded finished product are improved.

Description

technical field [0001] The invention relates to the technical field of chip welding, in particular to a packaging method for chip reliability vacuum packaging welding equipment. Background technique [0002] The packaging of vacuum packaging and welding equipment is greatly affected by the environment of vacuum and purified gas. The existing vacuum welding equipment is to extract the gas in the welding environment before welding, but it is impossible to extract the welding environment into a pure Vacuum, which also contains a certain amount of air, cannot guarantee the vacuum of the welding environment and the environment of purified gas, and cannot guarantee the stability and reliability of the finished product. Contents of the invention [0003] The invention provides a packaging method used for chip reliability sealing and chip reliability vacuum packaging welding equipment, which improves the stability and reliability of welding finished products. [0004] In order to...

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Problems solved by technology

[0002] The packaging of vacuum packaging and welding equipment is greatly affected by the environment of vacuum and purified gas. The existing vacuum welding equipment is to extract the gas in the welding environment before welding, but it is impossible to extract the welding environment into a pure Vacuum, which also contains a certain amount of air, cannot guarantee the vacuum of the welding environment and the environment of purified gas, and cannot guarantee the stability and reliability of the finished product

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