Motherboard production method

Abstract

The invention discloses a mother board manufacturing method, which includes: providing a daughter board, a copper block, a prepreg and a copper foil, wherein an organic film is formed on the surface of the copper block; and performing groove processing around the area of ​​the crimping hole , so as to form an auxiliary groove on the surface of the sub-board, the end of the auxiliary groove is connected to form an enclosed area, and the crimping hole area is located in the enclosed area; the copper block is embedded in the enclosed area In the above-mentioned auxiliary groove; the two sub-boards are stacked on each other, and the prepreg and copper foil are sequentially stacked on the enclosed area of ​​each of the sub-boards and pressed to form a mother board, and the copper foil is passed through The prepreg is bonded to the enclosed area; the motherboard is laser-opened to remove the copper foil crimped above the enclosed area; the present invention can increase the distance between the prepreg and the sub-board The chemical bonding force can effectively prevent the crimping hole from being corroded and damaged by the liquid medicine due to the falling off of the prepreg.

Description

technical field [0001] The invention relates to the field of circuit board processing and manufacturing, in particular to a mother board manufacturing method. Background technique [0002] The circuit boards of the current double-sided crimping process mainly adopt the N+N method for the asymmetrical design of the crimping holes on both sides of the circuit board, that is, two sub-boards with N-layer core boards are pressed together to obtain the motherboard of the above-mentioned circuit board. . When the two sub-boards are pressed into the motherboard, the crimping hole is protected by using copper foil + prepreg to avoid damage to the crimping hole due to liquid corrosion when the motherboard is wet-processed. When using copper foil + prepreg to protect the crimping hole, the surface treatment of the crimping hole area has been made, and there is only a gap between the prepreg and the gold surface (tin surface, silver surface, green oil, etc.) Physical binding force, it...

AI Technical Summary

Problems solved by technology

In the subsequent production process, the joint surface between the prepreg and the crimping hole area is easy to fall off under the action of external force, thus losing the protection of the copper foil on the crimping hole, so that the crimping hole is directly exposed to the external environment and is easily corroded by the potion and damaged

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