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Substrate processing apparatus

A substrate processing device and substrate technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as difficult-to-handle substrates

Pending Publication Date: 2021-03-23
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is sometimes difficult for the conventional substrate processing apparatus to properly process the substrate.

Method used

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  • Substrate processing apparatus
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Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0256]

[0257] figure 1 It is a top plan view of the substrate processing apparatus of the first embodiment. The substrate processing apparatus 1 processes the substrate W.

[0258] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display, an organic EL (FLAT PANEL DISPLAY), a substrate, a magnetic disk substrate, a disc substrate, a photomagical substrate, a light mask Substrates with substrates or solar cells.

[0259] The substrate processing apparatus 1 has an indexer portion 2. The degreasse unit 2 has a plurality of (e.g., four) receiving frame mounting units 3. Each of the accommodating frame mounting unit 3 is separately placed on a housing frame C. The accommodating frame C accommodates the plurality of substrate W. The accommodating frame C is, for example, a FOUP (Front Opening Unified POD: ancestral wafer conveying cartridge).

[0260] The accommodating frame C has a bar code (not shown). The bar code is, for example, an iden...

no. 2 approach

[0382] The substrate processing apparatus 1 of the second embodiment will be described with reference to the drawings. Further, the same structure as the first embodiment will be given the same reference numerals, and detailed description is omitted.

[0383] The substrate processing apparatus 1 of the second embodiment has substantially the same structure as the substrate processing apparatus 1 of the first embodiment. The processing unit 14 of the second embodiment performs different actions different from the processing unit 14 of the first embodiment. Next, the operation of the processing unit 14 of the second embodiment will be exemplified.

[0384]

[0385] In the operation example of the processing unit 14 of the second embodiment, the control unit 18 changes the amount QT of the blowout in accordance with the position of the recess 24. In the operation example of the processing unit 14 of the second embodiment, the control unit 18 changes the amount of blowing amount QT b...

no. 3 approach

[0416] The substrate processing apparatus 1 of the third embodiment will be described with reference to the drawings. Further, the same structure as the first embodiment will be given the same reference numerals, and detailed description is omitted.

[0417] The substrate processing apparatus 1 of the third embodiment has substantially the same structure as the substrate processing apparatus 1 of the first embodiment. The processing unit 14 of the third embodiment performs different actions different from the processing unit 14 of the first embodiment. Next, the operation of the processing unit 14 of the third embodiment will be exemplified.

[0418]

[0419] In the operation example of the processing unit 14 of the third embodiment, the control unit 18 changes the amount QT of the blowout according to the speed of the plate 32.

[0420] Figure 9 It is a flow chart showing the step of controlling the control of the control unit 18 and the operation of the processing unit 14.

...

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PUM

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Abstract

The present invention provides a substrate processing apparatus capable of appropriately processing a substrate. A substrate processing apparatus (1) includes a processing unit (14) and a control unit(18). The processing unit (14) processes the substrate (W). The control unit (18) controls the processing unit (14). The processing unit (14) has a plate (32), a rotation drive unit (45), a fixing pin (33), a gas discharge port (34), a discharge adjustment unit (40), a processing liquid supply unit (51), and a flow rate adjustment unit (57). The control unit (18) changes the flow rate of the gasdischarged from the gas discharge port (34) in accordance with at least one of the shape of the substrate (W) supported by the fixing pin (33), the rotational speed (RS) of the plate (32), and the flow rate (FR) of the processing liquid supplied to the substrate (W) supported by the fixing pin (33) by the processing liquid supply unit (51).

Description

Technical field [0001] The present invention relates to a substrate processing apparatus for processing a substrate. The substrate is, for example, a semiconductor wafer, a substrate for a liquid crystal display, an organic EL (Electroluminescence: electroluminescent) with substrate, FPD (FLAT PANEL DISPLAY: flat panel display), optical display substrate, disk substrate, optical disk substrate, optical disk Based on the substrate, the photomask substrate, or the solar cell substrate. Background technique [0002] Japanese Laid-Open Patent Publication No. 2015-65226 discloses a substrate processing apparatus. Hereinafter, the reference numerals described in Japanese Laid-Open Name Name Name is added to the parentheses. The substrate processing apparatus has a rotary table (10) of the placed substrate (100). The rotating stage (10) has a top surface portion (13) and a chuck portion (14). The upper surface portion (13) and the chuck portion (14) are opposed to the entire lower surfa...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/687H01L21/67
CPCH01L21/6838H01L21/6715H01L21/68792H01L21/6875H01L21/68764H01L21/68785H01L21/67253
Inventor 中泽和彦高山祐一森冈利仁蒲裕充佐藤卓也
Owner DAINIPPON SCREEN MTG CO LTD