Unlock instant, AI-driven research and patent intelligence for your innovation.

Wave soldering device for PCB

A PCB board and wave soldering technology, applied in auxiliary devices, welding equipment, printed circuits, etc., can solve problems such as poor soldering quality and inconvenient control

Active Publication Date: 2021-03-26
广州市诺的电子有限公司
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of wave soldering device for PCB board, to solve the problem that the existing wave soldering machine proposed in the above-mentioned background technology is not easy to control the welding process when soldering the PCB board pins, and the change of solder amount is easy Lead to problems such as poor welding quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wave soldering device for PCB
  • Wave soldering device for PCB
  • Wave soldering device for PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0027] In actual application, both the first transmission motor 301 (model YS7134) and the second transmission motor 402 (model YEJ3-112M-4) mentioned in the present invention can be purchased from the market or customized.

[0028] see Figure 1 to Figure 7 , an embodiment provided by the present invention: a wave soldering device for PCB boards, including a welding protection mechanism 1, through which the welding protection mechanism 1 is convenient for protecting the whole, and is convenient for heat dissipation and smoke exhaust, the inner side of the bottom of the welding protection mechanism 1 A lifting mechanism 4 is fixedly installed, and a welding mechanism...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a wave soldering device for a PCB (printed circuit board), relates to the technical field of wave soldering machines, and solves the problems that the soldering process is inconvenient to control and the soldering quality is easy to worsen due to the change of the solder amount when the existing wave soldering machine is used for soldering pins of the PCB. The wave soldering device comprises a soldering protection mechanism, a lifting mechanism is fixedly mounted on the inner side of the bottom end of the soldering protection mechanism, a soldering mechanism is mountedon the outer side of the middle of the lifting mechanism, a transmission lifting mechanism is mounted on the inner side of the upper end of the soldering protection mechanism and comprises a first transmission motor, a driving shaft is mounted at one end of the first transmission motor, and a driven shaft is mounted on the inner side of one end of the soldering protection mechanism on one side ofthe driving shaft. According to the wave soldering device for the PCB, the PCB is welded twice, the soldering quality is guaranteed, automatic contact between solder and pins is facilitated, use is convenient, and the soldering efficiency is high.

Description

technical field [0001] The invention relates to the technical field of wave soldering machines, in particular to a wave soldering device for PCB boards. Background technique [0002] With the rapid development of social economy and the increasing use of electrical equipment, the demand for PCB boards is also increasing. PCB circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is to greatly reduce wiring and assembly errors, improve the level of automation and production labor rate; according to the number of layers of circuit boards, it can be divided into For single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards, PCB boards are usually soldered by wave soldering machines. [0003] However, the existing wave solderin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00B23K3/08B23K1/08
CPCB23K3/00B23K3/08B23K1/085B23K2101/42
Inventor 贾顺飞
Owner 广州市诺的电子有限公司