A substrate processing method

Abstract

The invention discloses a substrate processing method, which comprises: the step of confirming the surface shape of the grinding target, performing polishing on the processing surface of the first substrate and obtaining the polished topography of the first substrate, and reversing the polished topography of the first substrate As the grinding target surface shape of the second substrate, the processed surface of the second substrate becomes flat after the grinding and polishing steps; in the grinding step, the attitude of the suction cup for placing the substrate is adjusted according to the grinding target surface shape to Grinding the second substrate; polishing step, polishing the ground second substrate.

Description

technical field [0001] The invention belongs to the technical field of substrate manufacturing, and in particular relates to a substrate processing method. Background technique [0002] In the post-process stage of integrated circuit / semiconductor (Integrated Circuit, IC) manufacturing, in order to reduce the package mounting height, reduce the chip package volume, improve the thermal diffusion efficiency, electrical performance and mechanical performance of the chip, and reduce the processing amount of the chip , the substrate needs to be thinned before subsequent packaging, and the chip thickness after thinning can even reach less than 5% of the initial thickness. [0003] Substrate thinning technology is mainly applied to the thinning of the back side of the substrate. The so-called back side refers to the side of the substrate that is not covered with devices, which is generally the substrate. The substrate material can be silicon, silicon oxide, silicon nitride, silicon...

AI Technical Summary

Problems solved by technology

[0004] However, the existing technology mainly relies on the processing experience of the equipment operator to determine the spindle pose of the thinning equipment after the substrate is thinned. Automatic and precise decision-making for posture adjustment

The existing method relying on the operating experience of the equipment operator has problems such as poor consistency of surface shape compensation, many iterations, slow speed, and low precision, which limits the accuracy, automation, and intelligence of the thinning equipment.

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