Unlock instant, AI-driven research and patent intelligence for your innovation.

Bonding head

A bonding head and bonding tool technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as sensitivity reduction and false detection, and achieve the effect of improving sensitivity and responsiveness without being easily affected.

Pending Publication Date: 2021-03-30
SHINKAWA CO LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is a problem that if the sliding resistance of the vertical support portion of the collet increases due to contamination over time, etc., the sensitivity will decrease and false detection will occur.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bonding head
  • Bonding head
  • Bonding head

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Hereinafter, the bonding head 100 according to the embodiment will be described with reference to the drawings. Such as figure 1 , figure 2 As shown, the bonding head 100 includes: a base 11, which moves in the up and down direction, that is, the Z direction through a Z-direction driving mechanism not shown in the figure; a bracket 12, which is fixed on the base 11; an arm 20, which is rotatably mounted on the lower end of the bracket 12 ; a spring 19 mounted on the Y-direction negative side end 22 of the arm 20 ; and a load sensor 25 . exist figure 1 Among them, the Z direction represents the up-down direction, and the XY direction represents the horizontal direction. In addition, each arrow of XYZ in a figure shows each positive direction.

[0020] The base 11 is a cuboid block and has an L-shaped protruding portion 15 on the upper end surface, and the front end of the L-shaped protruding portion 15 extends to the negative side in the Y direction. A hook 16 to w...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This bonding head comprises: a base (11) that moves in a vertical direction; an arm (20) that is attached to the base (11) such that it can rotate freely around a rotary shaft (13), a collet (21) being attached to one end of the arm; a spring (19) with an initial tensile force that is attached between the base (11) and the other end of the arm (20); a stopper portion (18) that restricts rotation of the arm (20) against the tensile force of the spring (19); and a load sensor (25) that detects an upward contact load applied to the collet (21). The load sensor (25) detects the contact load only when the rotation of the arm (20) is restricted by the stopper portion (18).

Description

technical field [0001] The present invention relates to a structure of a bonding head. Background technique [0002] Bonding devices for packaging semiconductor dies on substrates are widely used. In the bonding apparatus, a ground detection is performed to detect that the semiconductor die attracted to the front end of the collet is grounded to the surface of the substrate. In a conventional coupling device, a collet is supported by a spring, and ground contact detection is performed by disconnection of the contact due to displacement of the rear end of the collet when the front end of the collet touches the ground (for example, refer to Patent Document 1). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 7-45644 Contents of the invention [0006] The problem to be solved by the invention [0007] However, the conventional ground fault detection described in Patent Document 1 detects ground faults when ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/52H01L21/60
CPCH01L21/52H01L21/67144H01L21/67721H05K13/0404
Inventor 前田彻高山晋
Owner SHINKAWA CO LTD