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A quick glue removal device for positioning holes of PCB boards for electrical engineering

A technology for PCB boards and electrical engineering, which is applied to the field of quick glue removal devices for positioning holes of PCB boards for electrical engineering, can solve the problems of inconvenient feeding and low efficiency of removing glue from PCB boards, and achieves convenient feeding and reduction of manual work. The number of feedings and the effect of convenient feeding

Active Publication Date: 2022-05-13
普科(清新)电路板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the disadvantages of low glue removal efficiency and inconvenient loading of PCB boards, the technical problem of the present invention is to provide a fast positioning hole for PCB boards for electrical engineering with high glue removal efficiency and convenient loading of PCB boards. Glue removal device

Method used

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  • A quick glue removal device for positioning holes of PCB boards for electrical engineering
  • A quick glue removal device for positioning holes of PCB boards for electrical engineering
  • A quick glue removal device for positioning holes of PCB boards for electrical engineering

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] A kind of fast adhesive removal device for the positioning hole of the PCB board for electrical engineering, such as figure 1 As shown, it includes a base 1, a clamping mechanism 2 and a glue removing mechanism 3. The clamping mechanism 2 is arranged on the upper front of the base 1, and the glue removing mechanism 3 is arranged on the upper front side of the clamping mechanism 2.

[0067] When manually removing the glue in the positioning hole of the PCB board, the efficiency is low. The invention helps people improve the glue removal efficiency of the positioning hole of the PCB board. Firstly, the PCB board is placed in the clamping mechanism 2, and the clamping mechanism 2 clamps the PCB board Finally, start the glue removal mechanism 3, which will remove the glue on the positioning hole of the PCB board. After the glue removal is completed, close the glue removal mechanism 3 and take out the PCB board. When using the equipment again, repeat the above steps.

Embodiment 2

[0069] On the basis of Example 1, such as figure 2 and image 3As shown, the clamping mechanism 2 includes a first fixed frame 21, a first telescopic rod 22, a special-shaped clamp block 23 and a first spring 24, the upper front part of the base 1 is provided with a first fixed frame 21, and the first fixed frame 21 top Four first telescopic rods 22 are provided, and special-shaped clamping blocks 23 are arranged on the outside of the first telescopic rods 22, and first springs 24 are wound on the first telescopic rods 22, and the first springs 24 are connected with the first fixed frame 21 and the special-shaped clamping blocks. 23 connections.

[0070] When placing the PCB board, the PCB board is placed between the special-shaped clamping blocks 23 on the upper and lower sides, the PCB board squeezes the special-shaped clamping blocks 23 to move to the outside, the first spring 24 and the first telescopic rod 22 stretch, and the first spring 24 Give the special-shaped cla...

Embodiment 3

[0074] On the basis of Example 2, such as figure 1 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, it also includes a pusher mechanism 4, the base 1 is provided with a pusher mechanism 4, the pusher mechanism 4 is connected with the clamping mechanism 2, the pusher mechanism 4 includes a fixed seat 41, a second cylinder 42, a first fixed Plate 43, push block 44 and material discharge frame 45, first fixed frame 21 inner bottom side is provided with fixed seat 41, and second cylinder 42 is installed on the top of fixed seat 41, is provided with first fixed plate on the telescopic rod of second cylinder 42 43. A push block 44 is arranged on the upper side of the rear portion of the first fixed plate 43, and the push block 44 cooperates with the base 1, and a discharge frame 45 is arranged on the upper side of the rear portion of the base 1, and the discharge frame 45 cooperates with the push block 44.

[0075] People first place a large amount of PCB boards that ...

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Abstract

The invention relates to a glue removing device, in particular to a fast glue removing device for positioning holes of PCB boards used in electrical engineering. The invention provides a fast degumming device for PCB board positioning holes for electrical engineering with high degumming efficiency of PCB board and relatively convenient loading. A quick glue removal device for positioning holes of a PCB board for electrical engineering, comprising: a base and a clamping mechanism, the base is provided with a clamping mechanism; a glue removal mechanism, the clamping mechanism is provided with a glue removal mechanism. The invention achieves the effect of quickly removing excess glue in the positioning holes of the PCB board. Through the cooperation of the glue removing mechanism, the glue scraping mechanism and the adsorption mechanism, the invention can automatically remove the excess glue on the surface of the PCB board and in the positioning holes, and improve the glue removal efficiency. , It also achieves the effect of convenient loading. Through the cooperation of the clamping mechanism, the pushing mechanism and the guiding and positioning mechanism, the PCB boards that need to be glued can be placed uniformly, and then loaded gradually, reducing the number of manual loading and making the loading easier. Material is more convenient.

Description

technical field [0001] The invention relates to a glue removing device, in particular to a fast glue removing device for positioning holes of PCB boards used in electrical engineering. Background technique [0002] After gluing the PCB board, it is necessary to remove excess glue on the surface and in the positioning holes. [0003] Due to the small positioning holes, props are needed when manually removing glue, which is less efficient and requires more labor. The publication number is CN111632951A, which discloses a positioning hole glue removal device using steel plates for PCBs, including a first frame and Controller; the first frame is provided with a conveyor belt to connect the transitional feeding platform, glue removal platform and unloading platform; the glue removal platform is provided with a glue removal mechanism, and the glue removal mechanism includes the second frame, dry ice Crushers, air compressors, nozzles, the second frame is set across the glue remova...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C11/10B05C13/02
CPCB05C11/1039B05C13/02
Inventor 郑宗健
Owner 普科(清新)电路板有限公司
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