Core board layout method

Abstract

The invention discloses a core board layout method. The method comprises the steps of copying a core board schematic diagram into a target design schematic diagram; adding a peripheral circuit mainly comprising a core board module into the target design schematic diagram, generating a schematic diagram netlist after the peripheral circuit is connected with related pins of the core board module, and exporting the schematic diagram netlist; opening the core board PCB, designing a bottom board laminated structure according to the laminated structure of the core board PCB, importing the bottom board laminated structure into the schematic diagram netlist, and importing and storing devices of a peripheral circuit at the moment; and locking the core board module added with the PCB laminated structure, and adjusting peripheral circuit devices according to actual requirements to complete design. The core board serves as an assembly to be nested and designed in the bottom board, compared with the mode that the core board and the bottom board are welded in an overlapped mode, the poor welding problem caused by primary welding and secondary welding can be reduced, the development period can be shortened through the wiring design scheme of the core board, and the design difficulty can be reduced through the wiring design scheme of the core board.

Description

technical field [0001] The invention relates to the technical field of industry panel design, and more specifically relates to a core board layout method. Background technique [0002] In the industry tablet design project, in order to shorten the project cycle, the minimum core system of the board is made into a core board with stamp holes around it. When using the same platform solution to design a project every time, the core board is usually pasted on the Base plate, thereby reducing the design difficulty and shortening the project cycle. [0003] However, the method of soldering the core board to the bottom board, due to the relatively small shape of the core board, many reserved PIN pins, and the stamp holes around the core board cannot meet the design requirements, the LGA soldering added to the inner circle of the stamp hole around the core board The board is very difficult to solder, and there are many problems of virtual soldering and continuous soldering. The yie...

AI Technical Summary

Problems solved by technology

[0003] However, the method of soldering the core board to the bottom board, due to the relatively small shape of the core board, many reserved PIN pins, and the stamp holes around the core board cannot meet the design requirements, the LGA soldering added to the inner circle of the stamp hole around the core board board, which makes it very difficult to solder, and there are many problems of virtual soldering and continuous soldering. The yield rate of the board is low, and it cannot be analyzed and inspected during the debugging process, which increases the cost and difficulty of debugging.

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