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Wafer polishing head

A wafer and chuck technology, applied in the field of wafer grinding heads, can solve the problem of time required for replacement processes, and achieve the effects of realizing grinding steps, improving productivity, and achieving high efficiency

Pending Publication Date: 2021-04-16
OKAMOTO MACHINE TOOL WORKS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the replacement process takes time

Method used

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  • Wafer polishing head
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Embodiment Construction

[0026] Hereinafter, the wafer polishing head 1 according to the embodiment of the present invention will be described in detail based on the drawings. figure 1 It is a figure which shows the schematic structure of the wafer polishing apparatus provided with the wafer polishing head 1 which concerns on embodiment of this invention.

[0027] refer to figure 1 , the wafer polishing head 1 is installed in the wafer polishing apparatus. The wafer polishing head 1 is a device for sucking and holding the wafer W in the process of polishing the wafer W. As shown in FIG. The wafer W is, for example, a semiconductor wafer.

[0028] The wafer polishing apparatus is an apparatus for polishing a wafer W. As shown in FIG. The wafer polishing apparatus has a freely rotatable table 30 , a liquid supply nozzle 33 , and a wafer polishing head 1 .

[0029] The table 30 is freely rotatably set on the platform. The table 30 is driven to rotate by a rotating shaft 32 by a driving device not sh...

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Abstract

The present invention provides a wafer polishing head, which can improve productivity of a wafer polishing device and realize efficiency of the polishing step. A wafer polishing device (1) includes: a chuck mechanism with a rubber chuck (10) formed of an elastic body and a rigid chuck (11) formed of a rigid body; a first pressure adjusting mechanism (23) supplying air to the vicinity of the rubber chuck (10); and a second pressure adjusting mechanism (24) supplying air to the vicinity of the rigid chuck (11).The wafer polishing device (1) can switch the processing method by switching the air supply of the first pressure adjusting mechanism and the air supply of the second pressure adjusting mechanism. Thereby, it is possible to obtain the wafer polishing head that has both functions of a chuck mechanism of a rubber chuck system and a chuck mechanism of a rigid chuck system. Therefore, there is no need to provide two wafer polishing heads, and the productivity of the wafer polishing apparatus can be improved. In addition, there is no need to replace the wafer polishing head, and the efficiency of the polishing step can be improved.

Description

technical field [0001] The present invention relates to a wafer polishing head for holding a semiconductor wafer in a semiconductor wafer polishing step. Background technique [0002] Conventionally, as a chuck mechanism for surface reference polishing that performs polishing using the surface of a semiconductor wafer as a reference, a chuck mechanism having a suction chuck such as a rubber chuck made of an elastic body is known. [0003] For example, a semiconductor wafer polishing apparatus disclosed in Japanese Patent Laid-Open Publication No. Hei 7-263386 includes a pad member for sucking and holding a semiconductor wafer. The packing member is formed of elastic body such as silicon rubber or silicon foam. The pad member made of an elastic body disclosed in this document is fixedly attached to the lower surface of a holding plate provided above the polishing table. The semiconductor wafer is attached to the cavity into which the semiconductor wafer enters in a state of...

Claims

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Application Information

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IPC IPC(8): B24B37/11
CPCB24B37/30
Inventor 持丸顺行小林裕志五十岚保成上原幸夫高冈和宏
Owner OKAMOTO MACHINE TOOL WORKS LTD
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