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Laser machining apparatus

A laser processing machine, laser technology, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of complicated preparation work and time-consuming, and achieve the effect of a wide range of processing

Active Publication Date: 2021-04-16
MAKINO MILLING MASCH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In the laser processing machine of Patent Document 1, there is the following problem: Although it is possible to irradiate laser light to each surface of the three-dimensional substrate and at the same time realize the miniaturization of the device, each When changing the mounting jig for the workpiece (three-dimensional substrate), it is necessary to correct the positioning of the mounting jig for both the parallel link mechanism and the serial link mechanism, so the preparation work is complicated and time-consuming

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  • Laser machining apparatus
  • Laser machining apparatus
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Embodiment Construction

[0022] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[0023] exist figure 1 Among them, the laser processing machine 100 according to the preferred embodiment of the present invention has a bed 102 serving as a base fixed to the floor of a factory or the like. A column 104 is erected on the rear part of the upper surface of the bed 102, and a workbench 108 is installed on the front part of the upper surface of the bed 102 in a manner capable of reciprocating along a pair of Y-axis guide rails 106. The Y-axis guide rail 106 extends in the horizontal front-rear direction.

[0024] The Z-axis slider 140 is attached to the column 104 so as to be reciprocatable along a pair of Z-axis guide rails 142 extending in the vertical direction on the front surface of the column 104 . A head stock 144 as a sliding member is attached to the Z-axis slider 140 in a manner capable of reciprocating along a pair of X-axis guide rai...

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Abstract

A laser machining apparatus (100) for machining a workpiece (W) placed and fixed on a table (108) by moving the irradiation position of a laser beam on the workpiece while irradiating the workpiece is provided with: a laser oscillator (156); a laser irradiation head (110) that emits the laser beam from the laser oscillator toward the workpiece and that is provided with a galvano-scanner for moving a laser beam irradiation position on the surface of the workpiece in two directions; a parallel manipulator (130) that changes the orientation of the laser irradiation head; a slide member (114) that supports the parallel manipulator; and linear feed shaft device (150, 152) that moves the slide member in at least two orthogonal directions relatively to the table.

Description

technical field [0001] The present invention relates to a laser processing machine for processing a workpiece placed on a table by irradiating laser light and changing the irradiation position of the laser beam on the surface of the workpiece. Background technique [0002] Patent Document 1 describes a laser processing machine in which a three-dimensional substrate is placed on a circuit formed by a parallel link mechanism and a series link mechanism when forming a circuit by irradiating a laser beam on the surface of a three-dimensional substrate. The combined positioning mechanism performs posture control on the jig, and the positioning mechanism and the laser irradiation positioning mechanism are used to form circuits on multiple surfaces of the three-dimensional substrate. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2001-068817 Contents of the invention [0006] The problem to be solved by the inv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/082B23K26/08
CPCB23K26/082B23K26/0884B23K26/0853B23K26/046B23K26/03B23K26/38
Inventor 矢田贤一
Owner MAKINO MILLING MASCH CO LTD