Wafer bearing device
A carrier device and wafer technology, applied in the direction of transportation and packaging, conveyor objects, etc., to save operating time, reduce shaking, and reduce debris
Pending Publication Date: 2021-04-20
TIANJIN ZHONGHUAN ADVANCED MATERIAL TECH +1
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- Application Information
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Problems solved by technology
[0003] The invention provides a wafer carrying device, which is especially suitable for the transfer and placement of large-size wafers, which solves the technical problems of reducing the fragmentation rate during transportation, improving transfer efficiency and having a wide range of applications
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[0040] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0041] This embodiment proposes a wafer carrying device, such as Figure 1-3 As shown, there is a box body 10 for carrying wafers and a cover body 20 detachably matched with the box body 10, wherein the box body 10 and the cover body 20 are independently provided, and the cover body 20 is embedded and fixed on the box body 10 On the end face, the cover body 20 is operated to close or disassemble. Among them, several rows of body slot groups 11 for inserting wafers are provided in the box body 10; a cover slot group 21 corresponding to the body slot group 11 is provided on the side of the cover body 20 close to the box body 10; The wafer is placed in the gap slot formed by the body slot group 11 and the cover slot group 21; at the same time, a grippable base 30 is provided on one side of the box body 10; the base 30 is far away from the box b...
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Abstract
The invention provides a wafer bearing device. The wafer bearing device is provided with a box body used for bearing wafers, a base used for grabbing matching, a mounting base used for being matched with a detection machine, and a cover body matched with the box body, wherein the base and the mounting base are respectively arranged on the outer side of the box body and are arranged in an aligned manner; and the base and the mounting base are arranged in parallel with the wafer. The bearing device is particularly suitable for placing large-size wafers, is high in structural strength and stable in wafer placing, can cover the wafers, and reduces the fragment rate of the wafers; and the device can be matched with manual operation or mechanical arm clamping operation, enables a wafer to be placed horizontally or vertically, is wide in application range and high in practicability, improves the quality of wafers and improves production efficiency.
Description
technical field [0001] The invention belongs to the technical field of semiconductor silicon wafer production auxiliary equipment, and in particular relates to a wafer carrying device. Background technique [0002] In order to increase the number of chips on a single wafer and reduce production costs, the size of semiconductor wafers has grown from the existing 6 inches and 8 inches to 12 inches and 18 inches, and it is expected to develop larger diameters and thinner thicknesses semiconductor wafers. However, the carrying device for large-sized wafers is the key device to ensure the quality of wafers, especially during production turnover or shipment, wafers are prone to fragments and are easily polluted by the on-site environment; For transportation, personnel and automatic manipulators will cross-carry operations; in addition, for different environments, silicon wafers need to be placed at different angles, which is to ensure that silicon wafers can be placed both horizo...
Claims
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IPC IPC(8): H01L21/677
Inventor 裴坤羽武卫刘建伟由佰玲刘园孙晨光王彦君祝斌刘姣龙常雪岩杨春雪谢艳袁祥龙张宏杰刘秒吕莹徐荣清
Owner TIANJIN ZHONGHUAN ADVANCED MATERIAL TECH