circuit board assembly
A technology of circuit boards and components, which is applied to printed circuit components, printed circuits, electrical components, etc., can solve the problems of medium layering, poor bonding force of circuit board components, and short service life of circuit board components, so as to improve the bonding binding effect
Active Publication Date: 2021-12-07
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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Problems solved by technology
Therefore, the difference in the browning effect will directly determine the bonding force between the copper surface and the prepreg. When the bonding force is insufficient, it will easily lead to the delamination of the pressing medium, and even lead to the scrapping of the production board.
[0003] However, for the structure of the traditional circuit board assembly after browning, there is no browning layer in the copper paste plug hole of the circuit board assembly, so the bonding force of the circuit board assembly is poor after pressing, especially in the copper paste plug hole. The position corresponding to the hole, thus making the service life of the circuit board assembly shorter
Method used
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[0033] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0034] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...
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The application provides a circuit board assembly. The above-mentioned circuit board assembly includes a board, a first copper layer, an intermediate conductive column, a first copper covering, a second copper covering, a second copper layer, and a browning layer, and the board is provided with a first conductive plug hole; The number of the first copper layer is two, and the two first copper layers are respectively formed on the opposite sides of the first plate, and each first copper layer is provided with a second conduction connected with the first via plug hole plug hole; the middle is filled in the first conductive plug hole, the middle conductive column includes a copper paste block and two resin plugs, and each resin plug has a through hole; since the two browning layers are respectively formed on the two second The side of the second copper layer away from the first copper layer makes the browning layer only need to be formed on the surface of the second copper layer, which avoids the situation that the copper paste plug hole of the circuit board assembly cannot be browned, and greatly improves the circuit The press-fit bonding force of the board assembly is improved, thereby improving the service life of the circuit board assembly.
Description
technical field [0001] The invention relates to the technical field of circuit board assembly production, in particular to a circuit board assembly. Background technique [0002] Conductive copper paste is a composition including copper powder, thermosetting resin and solvent, which has the characteristics of high reliability and high conductivity, and plays an important role in the plugging process of circuit board components. As the first step in the lamination process of circuit board components, browning is an essential process in the process of circuit board component lamination. Browning is to chemically micro-etch the copper surface to produce a microscopic uneven surface shape and increase the contact area of the copper surface, and the micro-etched copper surface reacts with the inner layer bonding agent to form a layer of organic metal conversion. film to enhance the bonding force between the inner layer copper and the resin, thereby enhancing the thermal shock ...
Claims
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IPC IPC(8): H05K3/00H05K1/11H05K3/38H05K3/40
CPCH05K1/11H05K3/0094H05K3/382H05K3/4038
Inventor 许校彬肖尊民
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD